Thermal Engineering Co-Op: AI & HPC Cooling

AMD

Santa Clara (CA)

Hybrid

USD 20,000 - 32,000

Full time

5 days ago
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Job summary

AMD is seeking a highly motivated Thermal Engineering intern/co-op in Santa Clara, CA. You will work on advanced cooling technologies for AI, HPC, and data center platforms, supporting thermal characterization and modeling, while developing automation tools and conducting experiments.

The role requires enrollment in a U.S.-based Master’s program in Mechanical/Aerospace Thermal disciplines, with hands-on skills in heat transfer, CFD, CAD, and lab testing.

Qualifications

  • Currently enrolled in a U.S.-based university pursuing a Master’s degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or related field.
  • Knowledge in heat transfer, thermodynamics, and fluid mechanics and strong analytical skills.
  • Experience with thermal management, cooling technologies, and data acquisition is a plus.

Responsibilities

  • Support thermal and hydraulic characterization of cooling solutions (cold plates, manifolds, heat exchangers).
  • Evaluate air- and liquid-cooled platforms with thermal and flow analyses.
  • Assist with lab testing, instrumentation setup, sensors, and data acquisition.
  • Develop scripts/tools to automate test execution and data processing.
  • Contribute to thermal modeling, simulation, and comparison with design expectations.
  • Document findings and communicate results via reports and presentations.

Skills

Heat transfer
Thermodynamics
Fluid mechanics
Thermal-fluid systems
Engineering analysis
Thermal management
Laboratory testing
Sensors & data acquisition
CAD: SolidWorks/Creo
CFD tools (Icepak/Fluent/OpenFOAM)
Thermal modeling & simulation
Technical communication

Education

Master's in Mechanical/Aerospace Thermal

Tools

SolidWorks
Creo
ANSYS Icepak/Fluent
FloTHERM
COMSOL/OpenFOAM

Job description

AMD is seeking a highly motivated Thermal Engineering intern/co-op in Santa Clara, CA. You will work on advanced cooling technologies for AI, HPC, and data center platforms, supporting thermal characterization and modeling, while developing automation tools and conducting experiments.

The role requires enrollment in a U.S.-based Master’s program in Mechanical/Aerospace Thermal disciplines, with hands-on skills in heat transfer, CFD, CAD, and lab testing.

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