Thermal Design & Analysis Engineer II – Space Systems

Northrop Grumman; Baltimore (MD); On-site; USD 88,000 - 131,000; Full time

Benefits offered by this job

Total rewards

On-site facility

Job summary

Northrop Grumman Space Sector in Baltimore, MD is seeking a Thermal Design and Analysis Engineer – Level 2 to join our team onsite. You will develop, analyze, and test space hardware components and assemblies, performing thermal simulations and contributing to design reviews.

The role requires a STEM bachelor’s with 2 years experience or a master’s with none, ability to obtain a TS/SCI clearance, and hands-on experience with IcePak, Sinda/Fluint, or Thermal Desktop.

Qualifications

• Bachelor’s degree in a STEM field required or Master’s degree in STEM with 0 years of experience.
• Ability to obtain and maintain a U.S. Government Top Secret clearance with SCI access.
• On-site work daily at the Linthicum, MD facility; willingness to travel up to 10%.

Responsibilities

• Perform steady state and transient thermal analyses of components and assemblies to evaluate performance.
• Create system-level and subassembly thermal models for space hardware.
• Support design reviews, write test reports, and plan thermal test campaigns.
• Provide guidance to programs and mentor junior engineers.
• Collaborate with cross-functional teams to manage diverse workloads.

Skills

Thermal analysis

Problem solving

Verbal & written communication

On-site work

Team collaboration

Education

Bachelor’s degree in STEM

Master’s degree in STEM

Tools

IcePak

Sinda/Fluint

Thermal Desktop

Job description

Northrop Grumman Space Sector in Baltimore, MD is seeking a Thermal Design and Analysis Engineer – Level 2 to join our team onsite. You will develop, analyze, and test space hardware components and assemblies, performing thermal simulations and contributing to design reviews.

The role requires a STEM bachelor’s with 2 years experience or a master’s with none, ability to obtain a TS/SCI clearance, and hands-on experience with IcePak, Sinda/Fluint, or Thermal Desktop.