IC Packaging Design Engineer – Substrate & High-Speed

CORE Occupational Medicine; Chandler (AZ); On-site; USD 120,000 - 170,000; Full time

Job summary

CORE Occupational Medicine seeks an experienced IC Packaging Design Engineer for a 12+ month long-term contract. Location options include Chandler, AZ or Hillsboro, OR, onsite only.

The candidate will lead substrate design and high-speed layout for advanced packaging, collaborating closely with SI/PI, mechanical, and manufacturing teams. Ideal candidates have deep hands-on experience with Siemens Xpedition (XPD) or Cadence Allegro APD/SiP and a strong grasp of DRC, design for performance,

Qualifications

• Bachelor's or Master's degree in Electrical/Electronics Engineering.
• Senior Level: 10+ years of IC Packaging / Package Design experience.
• Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
• Strong hands-on experience with Siemens (Mentor) Xpedition (XPD).
• Experience with Cadence Allegro APD / SiP is also acceptable.
• Strong understanding of package substrate design and layout.

Skills

IC Package Layout

Substrate Design

Xpedition (XPD)

Cadence Allegro APD/SiP

DFM/DFT for packaging

Floor planning

High-speed routing

Cross-functional collaboration

DRC compliance

Education

Bachelor's/Master's in Electrical/Electronics Engineering

Tools

Siemens Mentor Xpedition (XPD)

Cadence Allegro APD/SiP

Job description

CORE Occupational Medicine seeks an experienced IC Packaging Design Engineer for a 12+ month long-term contract. Location options include Chandler, AZ or Hillsboro, OR, onsite only.

The candidate will lead substrate design and high-speed layout for advanced packaging, collaborating closely with SI/PI, mechanical, and manufacturing teams. Ideal candidates have deep hands-on experience with Siemens Xpedition (XPD) or Cadence Allegro APD/SiP and a strong grasp of DRC, design for performance,