Staff Thin-Film Process Development Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Benefits package

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a Staff Thin Film Process Development Engineer to own advanced deposition processes for next‑generation memory technologies.

You will translate device requirements into film properties, design DOEs, work with cross‑functional teams, and mentor engineers while driving projects from feasibility to integration.

This role emphasizes hands‑on experimentation, data‑driven decisions, and technical leadership in a fast‑paced semiconductor environment.

Qualifications

• Bachelor's degree in a relevant technical field plus 6+ years in the semiconductor industry.
• Hands-on experience with ALD, CVD, PECVD, PEALD, or similar thin‑film methods.
• Strong understanding of thin‑film deposition fundamentals and material properties.
• Experience moving a complex process‑development problem from root‑cause through DOE and validation.
• Experience collaborating across semiconductor process modules to resolve challenges.

Responsibilities

• Develop, optimize, and own advanced thin‑film deposition processes.
• Translate device and integration requirements into film properties and specifications.
• Design experiments and DOEs to identify mechanisms and sources of variation.
• Establish relationships between process conditions, film properties, and electrical performance.
• Provide technical leadership and mentorship across multidisciplinary teams.

Skills

Thin-film deposition

DOE design

Data analysis

Cross‑functional collaboration

AI analytics

Education

Bachelor's degree in a related technical field

Tools

XPS

AFM

XRD

AES

Ellipsometry

TEM/SEM

EBSD

SIMS

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a Staff Thin Film Process Development Engineer to own advanced deposition processes for next‑generation memory technologies.

You will translate device requirements into film properties, design DOEs, work with cross‑functional teams, and mentor engineers while driving projects from feasibility to integration.

This role emphasizes hands‑on experimentation, data‑driven decisions, and technical leadership in a fast‑paced semiconductor environment.