Principal Thin-Film Process Engineer — Memory & Logic

Micron Technology, Inc.; City of Albany (NY); On-site; USD 111,000 - 190,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Holidays

Job summary

Micron Technology, Inc. in the United States is seeking a senior engineer to advance thin-film material solutions for DRAM architectures, patterning, and emerging integration schemes.

Responsibilities include translating device requirements into film properties and manufacturable processes, designing rigorous experiments, and leading cross-functional teams to resolve material, defectivity, yield and reliability challenges.

Qualifications

• PhD or MS with 3+ years semiconductors experience.
• Thin-film materials/process development for semiconductors.
• DOE and data-driven experimentation experience.
• Ability to drive complex technical work and communicate across teams.

Responsibilities

• Develop thin-film and materials solutions for DRAM architectures.
• Translate device requirements into film properties and processes.
• Design and optimize deposition processes and DOE studies.
• Lead experiments; apply data-driven methods to optimize yield and reliability.
• Collaborate with process integration, patterning, etch, metrology, equipment, and suppliers.
• Provide technical leadership and mentor engineers.

Skills

DOE methods

Data-driven analysis

Project leadership

Cross-functional communication

Education

PhD/MS in relevant field

Tools

XPS

AFM

XRD

Ellipsometry

TEM/SEM

SIMS

Job description

Micron Technology, Inc. in the United States is seeking a senior engineer to advance thin-film material solutions for DRAM architectures, patterning, and emerging integration schemes.

Responsibilities include translating device requirements into film properties and manufacturable processes, designing rigorous experiments, and leading cross-functional teams to resolve material, defectivity, yield and reliability challenges.