Staff Package Design Engineer: Advanced Silicon Packaging

Renesas Electronics Corp.; Tempe (AZ); On-site; USD 120,000 - 160,000; Full time

Job summary

Renesas Electronics Corp. seeks a Staff Package Design Engineer to join its Advanced Silicon Packaging team in Tempe, AZ or Austin, TX. You will design and deliver high-performance package solutions across automotive, industrial, IoT, and AI-enabled platforms.

The role requires hands-on CAD layout for power modules, FCBGA, SiP, and chiplet architectures, with collaboration across SI/PI, thermal, reliability, and silicon design teams. Bachelor's/Master's in EE or related field is expected.

Qualifications

• 4+ years of hands-on experience in package CAD layout or advanced packaging.
• Experience with power modules, FCBGA, SiP, and multi-die architectures.
• Knowledge of DFM/DFA and manufacturing release standards.
• Experience interfacing with OSATs and suppliers.

Responsibilities

• Execute package layout design for advanced package technologies.
• Develop CAD databases and ensure manufacturability.
• Manage design cycle and release documentation.
• Collaborate with cross-functional teams (SI/PI, thermal, reliability, silicon design).

Skills

Power module packaging

FCBGA

SiP

WLCSP

Chiplet architectures

High-speed routing

Impedance control

Education

Bachelor's or Master's in Electrical Engineering / Microelectronics

Tools

Cadence Allegro Package Designer / SiP Layout

Siemens Xpedition Substrate Integrator

Job description

Renesas Electronics Corp. seeks a Staff Package Design Engineer to join its Advanced Silicon Packaging team in Tempe, AZ or Austin, TX. You will design and deliver high-performance package solutions across automotive, industrial, IoT, and AI-enabled platforms.

The role requires hands-on CAD layout for power modules, FCBGA, SiP, and chiplet architectures, with collaboration across SI/PI, thermal, reliability, and silicon design teams. Bachelor's/Master's in EE or related field is expected.