Solutions Architect – 3D-IC & Advanced Packaging Remote

Cadence Design Systems; Oregon; Hybrid; USD 162,000 - 302,000; Full time

Job summary

Cadence Design Systems seeks a Solutions Application Engineer to support customers developing next‑generation advanced packaging solutions, including 2.5D, 3D-IC, and chiplet‑based architectures. You will work with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package design flows.

The role blends technical leadership, customer engagement, solution development, and collaboration with R&D to drive customer success and product

Qualifications

• Bachelor's degree in Electrical or Electronics Engineering; 10+ years in semiconductor packaging.
• Strong knowledge of advanced package design methodologies and 2.5D/3D-IC integration.
• Experience with package layout, routing, and signoff; customer-facing skills.

Responsibilities

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with packaging architecture and methodology development.
• Develop and demonstrate packaging workflows for Organic substrates, silicon interposers, WLP, 2.5D/3D-IC, and chiplet-based architectures.
• Support customer evaluations, PoCs, benchmarks, and deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales to identify opportunities and provide pre-sales support.
• Work with R&D to communicate customer requirements and new technology needs.
• Support design-signoff methodologies (DRC/LVS, connectivity verification, electrical rule checking, thermal, SI, PI).

Skills

Advanced package design

2.5D/3D-IC integration

Chiplet-based architectures

High-speed signal design

Power delivery networks

Package layout & signoff

Customer-facing communication

Education

Bachelor's degree in Electrical or Electronics Engineering

Master's degree preferred

Tools

Cadence Integrity 3D-IC Platform

Cadence Sigrity

Clarity 3D Solver

Allegro X APD

Job description

Cadence Design Systems seeks a Solutions Application Engineer to support customers developing next‑generation advanced packaging solutions, including 2.5D, 3D-IC, and chiplet‑based architectures. You will work with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package design flows.

The role blends technical leadership, customer engagement, solution development, and collaboration with R&D to drive customer success and product