SiP Productization Engineer: High-Density RF Modules

Apple Inc.; Cupertino (CA); On-site; USD 172,100 - 258,600; Full time

Benefits offered by this job

Comprehensive medical and dental coverage

Retirement benefits

Discounted products and free services

Reimbursement for formal education expenses

Job summary

Apple Inc. in Cupertino, California is seeking a motivated and highly technical Component SiP Productization Engineer. The role focuses on product and process development, ensuring high-volume manufacturing quality while collaborating with suppliers and cross-functional teams.

Candidates should have strong experience in SiP and semiconductor packaging, with a minimum of 5 years in product engineering. The position offers competitive compensation and comprehensive benefits.

Qualifications

• 5+ years of relevant experience in product or process engineering.
• Strong understanding of various packaging processes and materials.
• Hands-on experience with supplier manufacturing process control.

Responsibilities

• Deliver SiP/module technologies while meeting constraints.
• Drive quality readiness at vendor factories.
• Lead supplier readiness across NPI phases.

Skills

SiP and semiconductor packaging

Data analysis and failure analysis

Interpersonal skills

Knowledge of reliability testing

Education

MS/BS in Electrical Engineering

Tools

SPC

JMP

Job description

Apple Inc. in Cupertino, California is seeking a motivated and highly technical Component SiP Productization Engineer. The role focuses on product and process development, ensuring high-volume manufacturing quality while collaborating with suppliers and cross-functional teams.

Candidates should have strong experience in SiP and semiconductor packaging, with a minimum of 5 years in product engineering. The position offers competitive compensation and comprehensive benefits.