SiP Process Engineer – Advanced Semiconductor Packaging

Keysight Technologies; Santa Rosa (CA); On-site; USD 139,000 - 232,000; Full time

Benefits offered by this job

Medical, dental and vision

401(k) Plan

Flexible Time Off

Tuition Reimbursement

Job summary

Keysight Technologies in Santa Rosa, CA is seeking a senior engineer to lead next-generation System in Package (SiP) module development across microwave and mmWave subsystems. You will drive process development for wafer fabrication and package assembly, and coordinate with upstream design, process and manufacturing teams.

Candidates should have a BS/MS/PhD in a relevant field and 5+ years in semiconductor fabrication or advanced packaging, with expertise in DFM, SMT, DOE, or related areas;

Qualifications

• BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 5+ years of applicable experience in semiconductor fabrication/advanced packaging processes.
• We are seeking an industry professional with proven expertise in three or more of the following areas: Design for manufacturing of electromechanical assemblies; Statistical process control (SPC), design of experiments (DOE); Thermocompression / flip chip bonding; Surface Mount Technology (SMT) processes; Die singulation; Semiconductor fabrication processes; Heterogeneous integration, advanced packaging techniques; New technology introduction; New product introduction.

Responsibilities

• Develop and maintain wafer fabrication processes
• Develop and maintain package assembly processes
• Specify, select and qualify new equipment
• Contribute to process automation
• Review new designs for manufacturability and provide feedback to module designers
• Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
• Meet accelerated project schedules; communicate and manage risks
• Develop and maintain high yields while adhering to project schedules

Skills

Leadership

Manufacturing experience

Project management

Semiconductor processes

DFM

DOE

SMT processes

Die singulation

Education

Engineering degree (BS/MS/PhD)

Job description

Keysight Technologies in Santa Rosa, CA is seeking a senior engineer to lead next-generation System in Package (SiP) module development across microwave and mmWave subsystems. You will drive process development for wafer fabrication and package assembly, and coordinate with upstream design, process and manufacturing teams.

Candidates should have a BS/MS/PhD in a relevant field and 5+ years in semiconductor fabrication or advanced packaging, with expertise in DFM, SMT, DOE, or related areas;