Semiconductor Operations - SiP Productization

Apple Inc.

Cupertino (CA)

On-site

USD 172,100 - 258,600

Full time

14 days+

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Benefits offered by this job

Comprehensive medical and dental coverage
Retirement benefits
Discounted products and free services
Reimbursement for formal education expenses

Job summary

Apple Inc. in Cupertino, California is seeking a motivated and highly technical Component SiP Productization Engineer. The role focuses on product and process development, ensuring high-volume manufacturing quality while collaborating with suppliers and cross-functional teams.

Candidates should have strong experience in SiP and semiconductor packaging, with a minimum of 5 years in product engineering. The position offers competitive compensation and comprehensive benefits.

Qualifications

  • 5+ years of relevant experience in product or process engineering.
  • Strong understanding of various packaging processes and materials.
  • Hands-on experience with supplier manufacturing process control.

Responsibilities

  • Deliver SiP/module technologies while meeting constraints.
  • Drive quality readiness at vendor factories.
  • Lead supplier readiness across NPI phases.

Skills

SiP and semiconductor packaging
Data analysis and failure analysis
Interpersonal skills
Knowledge of reliability testing

Education

MS/BS in Electrical Engineering

Tools

SPC
JMP

Job description

Semiconductor Operations - SiP Productization

Location: Cupertino, California, United States Operations and Supply Chain

Imagine what you could do here. At Apple, new ideas quickly become extraordinary products, services, and customer experiences. Bring passion and dedication to your job and there is no telling what you could accomplish. The people here at Apple create the kind of wonder that revolutionizes entire industries. Their diversity and ideas inspire the innovation that runs through everything we do. Join Apple and help us leave the world better than we found it.

Description

The Apple Semiconductor Operations team seeks a motivated, highly technical Component SiP productization engineer focusing on product and process development, supplier readiness, and high‑volume manufacturing quality. This role drives NPI execution, process bring‑up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high‑density module technologies. The successful candidate will work with module integration suppliers, OSATs, sub‑component vendors, PCB/substrate suppliers, and system integration sites, interfacing regularly with Engineering, Operations, Reliability, and Quality teams.

Responsibilities
  • Deliver high‑density and high‑performance SiP/module technologies within thermo‑mechanical, performance, reliability, quality, cost, and form‑factor constraints.
  • Support advance Component SiP and system integration development for future products, including design rules, process bring‑up, and materials/process selection.
  • Drive quality readiness at vendor factories for development builds, risk ramp, and mass production.
  • Lead supplier readiness across NPI phases, including process BKM lock, build‑exit criteria, factory audits, qualification status, and ramp‑risk closure.
  • Resolve process, yield, reliability, and quality issues in product and manufacturing processes.
  • Use data analysis and failure analysis to identify gaps in component design, package architecture, process capability, inspection coverage, and test readiness.
  • Work with vendors and OEM/system integration sites to ensure compliance with Apple specifications and manufacturing requirements.
  • Ensure qualification and reliability activities at suppliers align with product and process requirements.
  • Partner closely with component design, hardware engineering, reliability, PD FEA/simulation, operations, and quality teams.
  • Provide routine status reporting to leadership and expedite technical, quality, and supplier execution issues when needed.
Minimum Qualifications
  • Strong experience in SiP, semiconductor packaging, module assembly, or advanced packaging, including knowledge of assembly processes, materials, substrates, and package‑level failure mechanisms.
  • 5+ years of relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high‑volume manufacturing.
  • MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.
  • Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
  • Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board‑level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
  • Strong interpersonal skills to collaborate with design, development, operations, reliability, quality, supplier engineering, and other cross‑functional teams.
Preferred Qualifications
  • Hands‑on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
  • Ability to take advanced packages or modules from concept and development builds to high‑volume manufacturing.
  • Experience with RF, mmWave, antenna module, wireless module, high‑density package, or advanced SiP architecture.
  • Ability to communicate technical risk clearly, drive issue closure, and provide concise executive‑level updates.
  • Self‑motivated, good communicator, and able to lead complex issues across global suppliers.
Compensation and Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. The base pay range for this role is between $172,100 and $258,600, and your pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Employees are eligible for discretionary restricted stock unit awards and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan.

You’ll also receive the following benefits:

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • A range of discounted products and free services
  • Reimbursement for formal education expenses, including tuition

Note: These benefits, compensation, and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal‑opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

At Apple, we believe accessibility is a fundamental human right. We reflect this in our culture, benefits and digital tools, welcoming as many perspectives as possible to help you build a career where you feel like you belong.

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