SiP Process Engineer: Advanced Packaging & NPI

Keysight Technologies; Santa Rosa (CA); On-site; USD 126,930 - 211,550; Full time

Benefits offered by this job

Medical, dental and vision

Health Savings Account

401(k) Plan

Flexible Time Off

Paid Family Leave

Tuition Reimbursement

Job summary

A leading technology firm in Santa Rosa, CA, seeks an experienced professional to lead the development of System in Package (SiP) modules. The ideal candidate will have a degree in relevant engineering fields and proven expertise in semiconductor fabrication processes. Responsibilities include developing fabrication processes, ensuring manufacturability, and leading technology introductions. Candidates must either be local or willing to relocate, and U.S. citizenship or residency is required. The position offers a competitive salary and substantial benefits including medical and 401(k) plans.

Qualifications

• 2-5+ years of experience in semiconductor fabrication/advanced packaging processes.
• Professional experience in III-V compound semiconductors and/or silicon technologies is desired.
• Strong leadership, drive, and ambition to realize novel technologies.

Responsibilities

• Lead the development of next-generation System in Package (SiP) modules.
• Develop and maintain wafer fabrication and package assembly processes.
• Review new designs for manufacturability and provide feedback to designers.

Skills

Design for manufacturing of electromechanical assemblies

Statistical process control (SPC)

Thermocompression / flip chip bonding

Surface Mount Technology (SMT) processes

Die singulation

Semiconductor fabrication processes

Heterogeneous integration, advanced packaging techniques

New technology introduction

New product introduction

Education

BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry

Job description

A leading technology firm in Santa Rosa, CA, seeks an experienced professional to lead the development of System in Package (SiP) modules. The ideal candidate will have a degree in relevant engineering fields and proven expertise in semiconductor fabrication processes. Responsibilities include developing fabrication processes, ensuring manufacturability, and leading technology introductions. Candidates must either be local or willing to relocate, and U.S. citizenship or residency is required. The position offers a competitive salary and substantial benefits including medical and 401(k) plans.