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Lead the development of next‑generation System in Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight.
We focus on process research and development, process integration, and new product introduction.
BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2‑5+ years of applicable experience in semiconductor fabrication/advanced packaging processes.
Industry professional with proven expertise in three or more of the following areas:
Professional experience in the following areas is desired:
This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in the AI market. Excellent interpersonal and communication skills are important for successful cross‑functional interactions.
Candidates must be local or willing to relocate to Santa Rosa, CA
This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export‑controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export‑controlled items.
Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export‑controlled items under 8 U.S.C. 1324b(a)(3).
Keysight is an Equal Opportunity Employer.
Salary range: MIN $126,930 – MID PT $169,240 – MAX $211,550 (Santa Rosa, CA). Note: For other locations, pay ranges will vary by region.