Lead SIPI Architect - 3D Packaging & HBM
SK hynix America
14 days+
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Benefits offered by this job
Job summary
A leading semiconductor firm is seeking a Principal Engineer for Signal-Integrity and Power-Integrity to lead advanced packaging solutions. The role requires expertise in high-speed design and a Ph.D. in Electrical Engineering or relevant experience. You'll define SIPI strategies and mentor engineers while ensuring project deliverables are met. The position is onsite in San Jose and offers top-tier benefits like health insurance and educational reimbursement. Join a pioneering team at the forefront of semiconductor innovation.
Qualifications
- Ph.D. in Electrical Engineering or Master's with 5+ years of experience.
- 5+ years of hands-on SIPI engineering.
- Deep knowledge of 2.5D/3D package architectures.
Responsibilities
- Define and own the SIPI roadmap for advanced PKG families.
- Lead high-performance SiP architecture creation.
- Oversee the end-to-end design flow and validation.
Skills
Signal integrity
Power integrity
High-speed interface design
Electromagnetic extraction
Leadership
Communication
Education
Ph.D. in Electrical Engineering or related field
Tools
Ansys SIwave
Cadence Sigrity
Job description
A leading semiconductor firm is seeking a Principal Engineer for Signal-Integrity and Power-Integrity to lead advanced packaging solutions. The role requires expertise in high-speed design and a Ph.D. in Electrical Engineering or relevant experience. You'll define SIPI strategies and mentor engineers while ensuring project deliverables are met. The position is onsite in San Jose and offers top-tier benefits like health insurance and educational reimbursement. Join a pioneering team at the forefront of semiconductor innovation.
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