SiGe Wet Process R&D Engineer — 28nm Integration

118-WW TMG MFG OPS

Lehi (UT)

On-site

USD 120,000 - 180,000

Full time

14 days+
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Texas Instruments in Lehi, Utah, is seeking a Wet Process Development Engineer to own the development, integration and qualification of wet etch and clean modules for 28nm SiGe and silicidation flows. You will drive chemistry formulation, tool integration, yield analysis and production readiness across the full device fabrication sequence.

You will partner with Epi, Lithography, Spacer Films and CMP teams, apply SEM/TEM/ellipsometry/AFM metrology, and lead multiple workstreams under schedule

Qualifications

  • Master's or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field.
  • 5+ years in R&D semiconductor wafer fabrication for advanced nodes (28nm or below).
  • Hands-on experience with wet etch chemistries and with single-wafer or batch wet process tools.
  • Ability to lead cross-functional teams from concept to production-ready status.

Responsibilities

  • Module Integration: Develop and optimize wet process flows for SiGe epi-layer cleaning and selective removal without damage to underlying Si or gate oxide.
  • Selective Etching: Define chemistries for high-precision isotropic and anisotropic etching with focus on SiGe/Si/silicided film selectivity and undercut control at 28nm geometries.
  • Yield & Defectivity: Identify root causes of process-related defects using FMEA and 8D methodologies; implement SPC to support the yield ramp toward high-volume manufacturing.
  • Cross-Functional Collaboration: Partner with Epi, Lithography, Spacer Films, and CMP teams to ensure seamless integration of wet modules into the full 28nm SiGe and silicidation fabrication flow.
  • Metrology & Characterization: Utilize SEM, TEM, ellipsometry, and AFM to characterize surface roughness and etch profiles at atomic resolution.

Skills

DOE methodology
SPC (Statistical Process Control)
Cross-functional collaboration
Wet process knowledge

Education

Master's or Ph.D. in Materials Science or related field

Tools

LAM
TEL
SCREEN
Single-wafer tools
Batch wet process tools

Job description

Texas Instruments in Lehi, Utah, is seeking a Wet Process Development Engineer to own the development, integration and qualification of wet etch and clean modules for 28nm SiGe and silicidation flows. You will drive chemistry formulation, tool integration, yield analysis and production readiness across the full device fabrication sequence.

You will partner with Epi, Lithography, Spacer Films and CMP teams, apply SEM/TEM/ellipsometry/AFM metrology, and lead multiple workstreams under schedule

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

SiGe 28nm Wet Process Engineer - Clean & Etch Innovation
SiGe 28nm Wet Process Engineer - Clean & Etch Innovation

Texas Instruments • Lehi (UT)

On-site
USD 110,000 - 150,000
Wet Process Development Engineer
Wet Process Development Engineer

Texas Instruments • Lehi (UT)

On-site
USD 110,000 - 150,000
Wet Process Development Engineer
Wet Process Development Engineer

118-WW TMG MFG OPS • Lehi (UT)

On-site
USD 120,000 - 180,000
SiGe Epitaxy Process Engineer — High-Impact 300mm Fab
SiGe Epitaxy Process Engineer — High-Impact 300mm Fab

118-WW TMG MFG OPS • Richardson (TX)

On-site
USD 105,000 - 135,000
SiGe Epitaxy Process Engineer – 300mm Fab Optimization
SiGe Epitaxy Process Engineer – 300mm Fab Optimization

Texas Instruments Incorporated • Richardson (TX)

On-site
USD 85,000 - 110,000
BEOL Process Integration Engineer — 28/22nm & Beyond
BEOL Process Integration Engineer — 28/22nm & Beyond

Texas Instruments • Lehi (UT)

On-site
USD 120,000 - 180,000
Competitive pay and benefits
Diverse, inclusive workplace
Device/Process Integration Engineer (R&D)
Device/Process Integration Engineer (R&D)

118-WW TMG MFG OPS • Lehi (UT)

On-site
USD 140,000 - 190,000
Senior Silicon Wet-Etch Process Engineer
Senior Silicon Wet-Etch Process Engineer

Silfex, a Lam Research Company • Springfield (OH)

On-site
USD 85,000 - 110,000
Device/Process Integration Engineer (R&D)
Device/Process Integration Engineer (R&D)

Texas Instruments • Lehi (UT)

On-site
USD 100,000 - 130,000
Senior Silicon Etch Process Engineer
Senior Silicon Etch Process Engineer

Silfex, a Lam Research Company • United States

On-site
USD 90,000 - 140,000