Device/Process Integration Engineer (R&D)

Texas Instruments; Lehi (UT); On-site; USD 100,000 - 130,000; Full time

Job summary

A leading technology company in Lehi, Utah, is seeking a Process Integration Engineer to drive cutting-edge technology development. The role entails resolving complex integration issues, leading engineering teams, and enhancing process performance. Candidates should have a solid background in semiconductor physics and be adept at team leadership and effective communication. This position offers a dynamic work environment with a focus on innovation and collaboration.

Qualifications

• Experience in process technology development for semiconductor manufacturing.
• Ability to lead teams and communicate effectively across diverse groups.
• Proficient in data analysis and problem-solving methodologies.

Responsibilities

• Resolve complex integration issues in semiconductor processes.
• Lead a team to develop process requirements and specifications.
• Drive improvements in process performance and product differentiation.

Skills

Semiconductor device physics

Model-based problem solving

Data analysis

Leadership

Communication skills

Job description

Change the world. Love your job.

Texas Instruments is looking for an experienced engineer with a passion for process technology development. This position provides the opportunity to drive leading‑edge technology development for our embedded and analog businesses. Our team is primarily focused on developing 28nm and 22nm process technologies in a state‑of‑the‑art, growing 300mm analog and embedded wafer fab in Lehi, Utah.

The responsibilities of a Process Integration Engineer in this role include:

• Apply semiconductor device physics and model‑based problem solving to resolve complex integration issues through new processes and process‑flow integration, driving parametric and yield improvements
• Lead a team of engineers to develop a section of the process flow by defining process requirements, specifications, and scorecards to deliver the desired structural and parametric outcomes
• Drive process and device improvements through characterization, test, design of experiments (DOE), data analysis, and simulation
• Mentor engineers and share process‑integration best‑known methods (BKMs) for high‑k metal gate (HKMG) sub‑28nm nodes
• Partner with process, integration, reliability, packaging, and test engineering teams to deliver program goals
• Work closely with product groups to optimize process performance to meet critical final device parameters and enable differentiated products in the market

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.