Device/Process Integration Engineer (R&D)

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 140,000 - 190,000; Full time

Job summary

Texas Instruments in Lehi, Utah seeks an experienced Process Integration Engineer with a passion for developing 28nm/22nm process technologies. You will lead a team to define process requirements, drive DOE-driven improvements, and collaborate across functional groups to deliver high-performance devices.

The role requires a Master’s in Electrical Engineering and 10+ years of semiconductor factory experience, with strong problem-solving and leadership skills to mentor engineers and achieve

Qualifications

• Master’s in Electrical Engineering or semiconductor-focused discipline.
• 10+ years in semiconductor factory with MGHK CMOS experience.
• Strong DOE, data analysis, and translating learning into improvements.

Responsibilities

• Apply device physics and model-based problem solving to resolve integration issues and improve yield.
• Lead engineers to develop a section of the process flow by defining requirements and scorecards.
• Drive process and device improvements through DOE, data analysis, and simulations.
• Mentor engineers and share BKMs for HKMG sub-28nm nodes.
• Partner with process, integration, reliability, packaging, and test teams to meet program goals.
• Collaborate with product groups to optimize process performance for final device parameters.

Skills

DOE

Data analysis

Leadership

Cross-functional

Process optimization

Mentoring

Education

Master’s in Electrical Engineering

Job description

Change the world. Love your job. Texas Instruments is looking for an experienced engineer with a passion for process technology development. This position provides the opportunity to drive leading-edge technology development for our embedded and analog businesses. Our team is primarily focused on developing 28nm and 22nm process technologies in a state-of-the-art, growing 300mm analog and embedded wafer fab in Lehi, Utah.

The responsibilities of a Process Integration Engineer in this role include:

• Apply semiconductor device physics and model-based problem solving to resolve complex integration issues through new processes and process-flow integration, driving parametric and yield improvements
• Lead a team of engineers to develop a section of the process flow by defining process requirements, specifications, and scorecards to deliver the desired structural and parametric outcomes
• Drive process and device improvements through characterization, test, design of experiments (DOE), data analysis, and simulation
• Mentor engineers and share process‑integration best‑known methods (BKMs) for high‑k metal gate (HKMG) sub‑28nm nodes
• Partner with process, integration, reliability, packaging, and test engineering teams to deliver program goals
• Work closely with product groups to optimize process performance to meet critical final device parameters and enable differentiated products in the market

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Minimum requirements:

• Master’s in Electrical Engineering, Electrical and Computer Engineering or a semiconductor‑focused discipline (e.g., solid‑state physics, applied physics, quantum mechanics, etc.)
• 10+ years working in a semiconductor factory environment, with specific experience developing MGHK advanced CMOS devices for next‑generation technology nodes below 28nm
• Demonstrated strength in DOE, data analysis, and translating learning into process and parametric improvements

Preferred qualifications:

• Demonstrated ability to build strong working relationships with key stakeholders, internally and externally
• Strong technical communication and cross‑functional technical leadership skills
• Ability to ramp quickly on new systems, tools, and processes
• Strong interpersonal, analytical, and problem‑solving skills
• Proven ability to collaborate effectively across functions and within diverse teams
• High ownership mindset: takes initiative and drives for results
• Strong time‑management and prioritization skills, with a track record of on‑time project delivery
• Demonstrated technical teacher/mentor with a track record of developing early‑career engineers