BEOL Process Integration Engineer — 28/22nm & Beyond

Texas Instruments; Lehi (UT); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Competitive pay and benefits

Diverse, inclusive workplace

Job summary

Texas Instruments’ LFAB in Lehi, Utah, is seeking a BEOL Process Integration Engineer to drive integration for advanced lithography nodes (28/22nm and beyond). You will own BEOL process flow, collaborate with unit process development, RET/OPC validation, and ensure compatibility with test and packaging.

Strong planning, communication, and cross-functional teamwork are essential. Preferred candidates hold a PhD or Master’s in EE or Materials Science, with 5+ years in 28nm or smaller BEOL

Qualifications

• Master’s or PhD in a related engineering discipline.
• 5+ years with BEOL in 28nm or smaller nodes.
• Proven ability to plan, drive schedules and lead technical discussions.

Responsibilities

• Own BEOL process flow to meet electrical, yield and reliability targets.
• Design experiments with unit process development to optimize options.
• Validate OPC with RET team and improve as needed.
• Ensure silicon processing is compatible with test and packaging requirements.

Skills

BEOL process integration

28nm & below technology

OPC validation

Cross-functional collaboration

Education

Master’s degree in Electrical Engineering or Materials Science & Engineering

Ph.D. in Electrical Engineering or related field

Tools

RRAM

TFR

MIMCAP

Job description

Texas Instruments’ LFAB in Lehi, Utah, is seeking a BEOL Process Integration Engineer to drive integration for advanced lithography nodes (28/22nm and beyond). You will own BEOL process flow, collaborate with unit process development, RET/OPC validation, and ensure compatibility with test and packaging.

Strong planning, communication, and cross-functional teamwork are essential. Preferred candidates hold a PhD or Master’s in EE or Materials Science, with 5+ years in 28nm or smaller BEOL