Thin Films Module Development Engineer

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development organization. You will own deposition process development across ALD, CVD, PVD and related platforms, designing experiments to optimize materials, device performance and yield.

Responsibilities include collaborating with process integration, metrology, and equipment suppliers to accelerate technology development and enable 24/7 manufacturing operations on site at

Qualifications

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics or Chemistry.
• Experience with thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation or related vacuum processes.
• Strong ability to analyze process data, perform structured troubleshooting, and design robust experiments.

Responsibilities

• Own thin film metal deposition process development across ALD, CVD, PVD and related platforms.
• Design, implement, and optimize processes to meet specifications for materials, device performance and yield.
• Execute and analyze experiments to meet device requirements and support rapid yield improvement.
• Collaborate with cross-functional teams including process integration, metrology, yield, and equipment suppliers.

Skills

ALD/CVD/PVD deposition

Data analysis & experimental design

Cross-functional collaboration

Materials characterization & metrology

Education

PhD in Materials Science or related STEM

Tools

XRF

XPS

XRD

SEM

TEM

Ellipsometry

e-test

JMP

Excel

Python

R

SQL

Job description

Job Details: Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Core Responsibilities

Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field With at least 1+ years of experience in: Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design Preferred Qualifications: Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals Proficient with data analysis software including JMP, Excel, Python, R, SQL Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders Availability to work on site and support 24/7 manufacturing operations with on-call rotation For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology.

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