Member of Technical Staff - Thin Films Engineer

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Hybrid work model

Stock bonuses

Health benefits

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Senior Engineer to drive thin film deposition process innovation for HVM. You will lead development, optimization, and manufacturability across CVD/ALD/PVD, ensuring seamless transitions from development to high-volume production for Intel 18A, 3, 12nm and beyond.

The role demands expertise in process development, technical leadership, and collaboration with Technology Development, Manufacturing, and supplier teams to meet aggressive node targets.

Qualifications

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
• 5+ years semiconductor industry experience with strong focus on thin film deposition processes -OR- PhD and 3+ years of Industry experience
• Proven experience in process development, technical leadership, and manufacturing engineering
• Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
• Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
• Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Responsibilities

• Process Innovation & Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
• Drive defectivity reduction and uniformity improvements through systematic process enhancement
• Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
• Optimize equipment performance working with internal teams and key suppliers
• Strategic Technical Leadership Align technical vision with customer requirements and business objectives
• Synthesize complex technical data to formulate and execute strategic responses
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
• Deliver rapid execution of innovative solutions to meet challenging development timelines
• Cross-Functional Partnership Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
• Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
• Present technical findings effectively to diverse audiences from engineering teams to executive leadership
• Foster in-person collaboration to accelerate decision-making and problem resolution
• Industry Leadership Stay current with semiconductor industry trends and emerging process technologies
• Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
• Contribute to technology roadmaps through hands-on technical expertise and market insight

Skills

Technical leadership

Cross-functional collaboration

Analytical skills

Communication skills

Problem solving

Education

Master's degree in STEM field

PhD (preferred)

Tools

AMAT

LAM

ASM

TEL

Job description

Job Details: Job Description: Organization Overview Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) andHigh-VolumeManufacturing (HVM), advancing technology nodes and process capability frominitialproduct qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.

About This Role

Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Your Mission

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Key Responsibilities

• Process Innovation & Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
• Drive defectivity reduction and uniformity improvements through systematic process enhancement
• Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
• Optimize equipment performance working with internal teams and key suppliers
• Strategic Technical Leadership Align technical vision with customer requirements and business objectives
• Synthesize complex technical data to formulate and execute strategic responses
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
• Deliver rapid execution of innovative solutions to meet challenging development timelines
• Cross-Functional Partnership Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
• Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
• Present technical findings effectively to diverse audiences from engineering teams to executive leadership
• Foster in-person collaboration to accelerate decision-making and problem resolution
• Industry Leadership Stay current with semiconductor industry trends and emerging process technologies
• Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
• Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For

• Technical Excellence Results-driven professional with exceptional technical problem-solving abilities
• Proven track record of significant accomplishments across multiple technology nodes
• Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
• Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer Leadership Capabilities
• Outstanding communication skills for presenting complex technical information to varied audiences
• Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
• Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
• Experience driving clarity in complex technical situations and leading cross-functional initiatives
• Industry Expertise Comprehensive knowledge of process development, materials science, and device physics
• Ability to interpret industry trends and translate market dynamics into actionable technical strategies
• Experience with foundry business models and customer engagement requirements
• Proven capability to work independently while managing diverse technical assignments

Qualifications

Minimum Qualifications

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
• 5+ years semiconductor industry experience with strong focus on thin film deposition processes -OR- PhD and 3+ years of Industry experience
• Proven experience in process development, technical leadership, and manufacturing engineering
• Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
• Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
• Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications

• Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
• Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
• Proven track record delivering customized solutions across Technology Development and HVM organizations
• Cross-functional leadership experience managing diverse stakeholder groups
• Semiconductor foundry experience

We invite you to bring your expertise and passion to Intel, where you'll have the opportunity to grow your career, make meaningful contributions, and shape the future of technology.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust: N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.