Senior Thermal Engineer – Direct-to-Chip Cooling

Oracle; Houston (TX); On-site; USD 114,600 - 234,600; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Disability insurance

Life insurance

401(k) match

Paid time off

Job summary

Oracle is seeking an experienced engineer to lead deployment and management of direct-to-chip liquid cooling with external manufacturing partners. You will ensure robust implementation, oversee supplier collaboration, and push for innovative thermal management solutions.

This role requires 5+ years in thermal systems engineering, experience with liquid cooling for HPC/data centers, and strong communication skills to coordinate across suppliers and internal teams.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
• 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data centers.
• Hands‑on experience with manufacturing processes, supplier management, and technology transfer.
• Strong understanding of liquid cooling‑specific reliability, safety, and performance challenges.
• Demonstrated experience in supplier development, process audit, and technical troubleshooting.
• Excellent verbal and written communication skills; able to translate complex technical information for varied audiences.
• Ability to travel domestically and internationally to manufacturing sites as required.
• Experience with cold plate cooling systems.
• Familiarity with industry standards, guidelines, and environmental compliance for data center cooling (ASHRAE, OCP, RoHS, etc).
• Prior exposure to scaling cooling systems from lab/POC to mass production.
• Exposure and experience with coolant chemistries and technologies.

Responsibilities

• Lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners.
• Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
• Oversee qualification, integration, and mass production at external sites, ensuring quality and safety.
• Drive joint problem-solving on yield, performance, and manufacturing challenges.
• Review and validate designs against system-level interfaces (mechanical, fluid, thermal, electrical).
• Audit supplier manufacturing processes for compliance with standards.
• Support continuous improvement from manufacturing feedback and field data.
• Prepare and maintain technical documentation and validation results.
• Provide technical training to manufacturing partners.

Skills

Thermal systems engineering

Liquid cooling for HPC/data centers

Manufacturing experience

Supplier management

Technology transfer

Liquid cooling reliability

Safety compliance

Troubleshooting

Communication skills

Willing to travel

Cold plate cooling

Industry standards (ASHRAE/RoHS)

Scale-up from lab to production

Coolant chemistries

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or related field

Job description

Oracle is seeking an experienced engineer to lead deployment and management of direct-to-chip liquid cooling with external manufacturing partners. You will ensure robust implementation, oversee supplier collaboration, and push for innovative thermal management solutions.

This role requires 5+ years in thermal systems engineering, experience with liquid cooling for HPC/data centers, and strong communication skills to coordinate across suppliers and internal teams.