Principal Thermal Engineer

Oracle; Houston (TX); On-site; USD 114,600 - 234,600; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Disability insurance

Life insurance

401(k) match

Paid time off

Job summary

Oracle is seeking an experienced engineer to lead deployment and management of direct-to-chip liquid cooling with external manufacturing partners. You will ensure robust implementation, oversee supplier collaboration, and push for innovative thermal management solutions.

This role requires 5+ years in thermal systems engineering, experience with liquid cooling for HPC/data centers, and strong communication skills to coordinate across suppliers and internal teams.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
• 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data centers.
• Hands‑on experience with manufacturing processes, supplier management, and technology transfer.
• Strong understanding of liquid cooling‑specific reliability, safety, and performance challenges.
• Demonstrated experience in supplier development, process audit, and technical troubleshooting.
• Excellent verbal and written communication skills; able to translate complex technical information for varied audiences.
• Ability to travel domestically and internationally to manufacturing sites as required.
• Experience with cold plate cooling systems.
• Familiarity with industry standards, guidelines, and environmental compliance for data center cooling (ASHRAE, OCP, RoHS, etc).
• Prior exposure to scaling cooling systems from lab/POC to mass production.
• Exposure and experience with coolant chemistries and technologies.

Responsibilities

• Lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners.
• Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
• Oversee qualification, integration, and mass production at external sites, ensuring quality and safety.
• Drive joint problem-solving on yield, performance, and manufacturing challenges.
• Review and validate designs against system-level interfaces (mechanical, fluid, thermal, electrical).
• Audit supplier manufacturing processes for compliance with standards.
• Support continuous improvement from manufacturing feedback and field data.
• Prepare and maintain technical documentation and validation results.
• Provide technical training to manufacturing partners.

Skills

Thermal systems engineering

Liquid cooling for HPC/data centers

Manufacturing experience

Supplier management

Technology transfer

Liquid cooling reliability

Safety compliance

Troubleshooting

Communication skills

Willing to travel

Cold plate cooling

Industry standards (ASHRAE/RoHS)

Scale-up from lab to production

Coolant chemistries

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or related field

Job description

Job Description

We are seeking a skilled engineer or scientist to lead the deployment and management of direct-to-chip liquid cooling technology with our external manufacturing partners. The successful candidate will ensure robust technical implementation, drive quality standards, oversee supplier collaboration, and support the innovation of advanced thermal management solutions.

Key Responsibilities

• Serve as the technical lead for direct-to-chip liquid cooling systems with a focus on collaboration across external manufacturers and internal stakeholders.
• Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
• Oversee the qualification, integration, and mass production of liquid cooling systems at external manufacturing sites, ensuring adherence to company quality, safety, and performance standards.
• Drive joint problem-solving efforts on yield, performance, and manufacturing challenges related to liquid cooling technologies.
• Review and validate engineering designs, ensuring alignment with system-level requirements (mechanical, fluid, thermal, and electrical interfaces).
• Review and audit supplier manufacturing processes for compliance with company and industry regulations.
• Support the continuous improvement of cooling designs based on manufacturing feedback and field data.
• Prepare, review, and maintain documentation, including test plans, technical reports, process control documents, and validation results.
• Provide technical training and guidance to manufacturing partners as needed.

Skills

• Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
• 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high-performance computing or data centers.
• Hands‑on experience with manufacturing processes, supplier management, and technology transfer.
• Strong understanding of liquid cooling‑specific reliability, safety, and performance challenges.
• Demonstrated experience in supplier development, process audit, and technical troubleshooting.
• Excellent verbal and written communication skills; able to translate complex technical information for varied audiences.
• Ability to travel domestically and internationally to manufacturing sites as required.
• Experience with cold plate cooling systems.
• Familiarity with industry standards, guidelines, and environmental compliance for data center cooling (ASHRAE, OCP, RoHS, etc).
• Prior exposure to scaling cooling systems from lab/POC to mass production.
• Exposure and experience with coolant chemistries and technologies.

Qualifications

Disclaimer: Certain U.S. based or U.S. customer or client‑facing roles may be required to comply with applicable requirements, such as immunization/occupational health mandates, and/or drug testing requirements.

Range and benefit information provided in this posting are specific to the stated locations only

US: Hiring Range in USD from: $114,600 - $234,600 per year. May be eligible for bonus, equity, and compensation deferral.

Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge, skills, experience, market conditions and locations, as well as reflect Oracle's differing products, industries and lines of business.

Candidates are typically placed into the range based on the preceding factors as well as internal peer equity.

Oracle US offers a comprehensive benefits package which includes the following:

• Medical, dental, and vision insurance, including expert medical opinion
• Short term disability and long term disability
• Life insurance and AD&D
• Supplemental life insurance (Employee/Spouse/Child)
• Health care and dependent care Flexible Spending Accounts
• Pre‑tax commuter and parking benefits
• 401(k) Savings and Investment Plan with company match
• Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non‑overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week, the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.
• 11 paid holidays
• Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.
• Paid parental leave
• Adoption assistance
• Employee Stock Purchase Plan
• Financial planning and group legal
• Voluntary benefits including auto, homeowner and pet insurance

The role will generally accept applications for at least three calendar days from the posting date or as long as the job remains posted.

Career Level - IC4

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