Lead Thermal Engineer: Direct-to-Chip Cooling & Manufacturing

Oracle; Nashville (TN); On-site; USD 114,600 - 234,600; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) with match

Paid time off

Disability insurance

Parental leave

Job summary

Oracle is seeking an engineer/scientist to lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners. You will drive technical implementation, collaborate across internal stakeholders, and ensure quality and performance standards are met.

The ideal candidate has 5+ years in thermal systems engineering, hands-on manufacturing exposure, and strong communication skills for translating complex tech to varied audiences.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
• 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for HPC or data centers.
• Hands-on experience with manufacturing processes, supplier management, and technology transfer.
• Strong understanding of liquid cooling reliability, safety, and performance challenges.
• Experience in supplier development, process audit, and technical troubleshooting.

Responsibilities

• Lead the deployment and management of direct-to-chip liquid cooling with external manufacturers.
• Develop and maintain technical specs and requirements for direct-to-chip cooling solutions.
• Oversee qualification, integration, and mass production of cooling systems at external sites with quality and safety standards.
• Drive joint problem solving on yield, performance, and manufacturing challenges.

Skills

Thermal systems

Liquid cooling

Supplier management

Engineering documentation

Cross-functional communication

Travel willingness

Safety & reliability

Problem solving

Standards compliance

Direct-to-chip cooling

Education

Bachelor’s or Master’s in Mechanical/Chemical/Materials Eng

Job description

Oracle is seeking an engineer/scientist to lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners. You will drive technical implementation, collaborate across internal stakeholders, and ensure quality and performance standards are met.

The ideal candidate has 5+ years in thermal systems engineering, hands-on manufacturing exposure, and strong communication skills for translating complex tech to varied audiences.