Thermal Engineer - SoC to Rack Integration

Majestic Labs ai; Los Altos (CA); On-site; USD 150,000 - 230,000; Full time

Job summary

Majestic Labs ai seeks a Senior Thermal Engineer to own the full thermal design lifecycle for high-performance computing cooling systems. This on-site, IC role requires deep hands-on expertise in liquid cooling from silicon-level cold plates to rack-scale infrastructure, CFD simulation, and AI/GPU-based system design.

Responsibilities include end-to-end design from concept to production, optimizing micro-channel cold plates, and validating rack-level cooling with fluid management.

Qualifications

• 10+ years of thermal engineering experience in liquid cooling for high-performance/data center environments.
• B.S. or M.S. in Mechanical Engineering or related field.
• Proven track record owning a full product lifecycle from concept to high-volume manufacturing.

Responsibilities

• Own end-to-end thermal design from concept through production (SoC cold plate through rack-scale cooling).
• Design and optimize high-power silicon cold plates with micro-channel geometry and fluid integration.
• Architect and validate rack-level liquid cooling including manifolds and full loop management.
• Lead CFD simulations to validate cooling strategies for high-density nodes.
• Collaborate with internal hardware teams and external partners on integrated thermal solutions for AI/GPU platforms.

Skills

Thermal engineering

Liquid cooling

CFD simulation

SoC design

Rack cooling

Tools

ANSYS Fluent

Icepak

Job description

We are seeking a Senior Thermal Engineer with 10+ years of experience to own the full thermal design lifecycle of advanced cooling systems for high-performance computing hardware. This is an on-site, individual contributor role for a candidate with deep hands‑on expertise in liquid cooling architecture from silicon-level cold plate design through rack‑scale fluid infrastructure, CFD simulation, and AI/GPU-based system design.

Responsibilities

• Own end-to-end thermal design from concept through production, spanning SoC-level cold plate development through rack-scale liquid cooling infrastructure, including hybrid air and liquid cooling systems.
• Design and optimize high-power silicon cold plates, including internal micro‑channel geometry, thermal interface integration, and fluid inlet/outlet configuration directly at the SoC package level.
• Architect and validate rack-level liquid cooling infrastructure including manifold layout, blind‑mate quick disconnect integration, and full loop pressure and flow management.
• Drive CFD simulation efforts to validate cooling strategies for high-density nodes, optimizing fluid flow, pressure drop, and heat transfer from chip to rack.
• Partner closely with internal hardware teams and external partners to deliver integrated thermal solutions for AI/GPU-based platforms.

Required Qualifications

• 10+ years of thermal engineering experience with deep expertise in liquid cooling systems spanning SoC-level and rack-level implementations in high-performance or data center environments.
• B.S. or M.S. in Mechanical Engineering or a related field.
• Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
• Liquid Cooling Expertise: Expert-level experience in cold plate design for high-power silicon devices and rack-level liquid‑cooled manifold systems, including micro‑channel optimization, blind‑mate quick disconnect integration, and full loop architecture from node to rack scale.
• Fluid Systems & Simulation: Deep understanding of water pressure dynamics, flow balancing, and leak‑mitigation best practices, with proficiency in CFD tools (e.g., Ansys Fluent, Icepak, or equivalent) to simulate and validate complex thermal and fluid systems from component to system level.
• Familiarity with airflow principles and air cooling requirements for high-density server and rack architectures.
• Direct experience with AI/GPU-based compute architectures and ultra-high-density power delivery systems.

Preferred Qualifications

• Direct experience with thermal interface materials (TIMs), including selection, characterization, and application in high-power assemblies.
• Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
• Experience with blind-mate liquid and power interfaces.