Lead Thermal Engineer – Direct-to-Chip Liquid Cooling

Oracle; United States; On-site; USD 114,600 - 234,600; Full time

Benefits offered by this job

Medical, dental, and vision insurance

401(k) Savings and Investment Plan

Stock Purchase Plan

Paid time off and holidays

Parental leave

Job summary

Oracle is seeking an experienced engineer to lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners. This role ensures robust implementation, drives quality standards, and supports innovative thermal management solutions across supplier networks.

The candidate will oversee qualification and mass production at external sites, review designs for multi-disciplinary interfaces, and drive continuous improvement based on field data and manufacturing

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, or a closely related field.
• 5+ years of experience in thermal systems engineering, preferably with direct experience in liquid cooling for high‑performance computing or data centers.
• Hands-on experience with manufacturing processes, supplier management, and technology transfer.
• Strong understanding of liquid cooling reliability, safety, and performance challenges.
• Demonstrated experience in supplier development, process audit, and technical troubleshooting.
• Excellent verbal and written communication skills; able to translate complex technical information for varied audiences.
• Ability to travel domestically and internationally to manufacturing sites as required.
• Experience with cold plate cooling systems.
• Familiarity with industry standards and environmental compliance for data center cooling (ASHRAE, OCP, RoHS).
• Exposure to scaling cooling systems from lab to mass production.
• Exposure to coolant chemistries and technologies.

Responsibilities

• Lead as technical lead for direct-to-chip liquid cooling systems with external manufacturers and internal stakeholders.
• Develop and maintain technical specifications and requirements for direct-to-chip cooling solutions.
• Oversee qualification, integration, and mass production at external sites, ensuring quality and safety standards.
• Drive joint problem-solving on yield, performance, and manufacturing challenges in liquid cooling.
• Review and validate engineering designs for mechanical, fluid, thermal, and electrical interfaces.
• Audit supplier manufacturing processes for compliance with company and industry regulations.
• Support continuous improvement of cooling designs from manufacturing feedback and field data.
• Prepare, review, and maintain documentation including test plans and validation results.
• Provide technical training and guidance to manufacturing partners.

Skills

Liquid cooling

Thermal systems

Supplier management

Manufacturing processes

Regulatory compliance

Technical leadership

Communication skills

Travel (domestic/international)

Reliability & safety

Education

Bachelor’s or Master’s in Mechanical Engineering, Chemical Engineering, Materials Science, or related field

Job description

Oracle is seeking an experienced engineer to lead the deployment and management of direct-to-chip liquid cooling with external manufacturing partners. This role ensures robust implementation, drives quality standards, and supports innovative thermal management solutions across supplier networks.

The candidate will oversee qualification and mass production at external sites, review designs for multi-disciplinary interfaces, and drive continuous improvement based on field data and manufacturing