SiP Layout Design Engineer

Analog Devices; Wilmington (MA); On-site; USD 117,000 - 161,000; Full time

Job summary

Analog Devices, Inc. in Wilmington, MA, seeks an experienced SiP layout design engineer with strong laminate and PCB layout expertise for advanced packaging.

You will design and optimize routing, power/ground planes, interposer stack‑ups, and collaborate with IC design and package teams to ensure layout requirements are met. This role also involves DRCs, layout verification, and project‑level coordination.

Qualifications

• 5+ years of hands‑on experience in laminate, substrate, PCB, or advanced package layout design.
• Strong understanding of routing, stack‑up design, impedance control, and manufacturability constraints.
• Experience with BGA/LGA, flip‑chip, system‑in‑package, and module‑based products.

Responsibilities

• Develop laminate, substrate, interposer, and PCB layout designs for flip‑chip, SiP, and module‑based solutions.
• Design and optimize routing, power/ground planes, vias, and stack‑ups to meet electrical, thermal, and reliability requirements.
• Collaborate with IC design, package, and product teams; perform DRCs, layout verification, and design reviews.

Skills

Laminate/substrate design

Signal integrity awareness

Cross-functional teamwork

Analytical skills

Education

Bachelor’s degree in Electrical Engineering

Tools

Cadence Allegro

CAD software

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

We are looking for an experienced and detail-oriented SiP layout design engineer with strong expertise in laminate and PCB layout design for advanced semiconductor packaging applications. This role will support the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments. Candidates will be expected to:

• Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
• Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements.
• Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements.
• Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules.
• Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis for new package concepts.
• Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials.
• Manage multiple layout projects, develop realistic layout schedules, track progress, and communicate status, risks, and issues to cross-functional teams.

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
• 5+ years of hands‑on experience in laminate, substrate, PCB, or advanced package layout design.
• Strong understanding of laminate, substrate, and PCB layout principles, including routing, stack‑up design, power/ground plane design, via design, impedance control, creepage/clearance, and manufacturability constraints.
• Strong knowledge of package structures, including BGA, LGA, flip‑chip, system‑in‑package, multi‑die packages, and module‑based products.
• Proficiency in Cadence Allegro and CAD software.
• Familiarity with signal integrity, power integrity, thermal, mechanical, and reliability considerations in layout design.
• Ability to manage multiple projects, meet schedules, and deliver high‑quality layout work with minimal supervision.
• Strong analytical skills, attention to detail, and ability to identify and resolve complex layout‑related issues.
• Strong communication skills and ability to work effectively in cross‑functional and global teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: No

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $116,960 to $160,820.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.