Senior Solutions Engineer - 3D-IC & Chiplet Packaging (Remote)

Cadence Design Systems, Inc.; San Jose (CA); Hybrid; USD 127,000 - 237,000; Full time

Benefits offered by this job

Medical, dental, vision

401(k) with match

Employee stock purchase plan

Paid vacation and holidays

Job summary

Cadence Design Systems, Inc. is seeking a Principal Solutions Engineer for Advanced Packaging, 3D-IC, and SI/PI. The role focuses on leading applications engineering for Cadence 3D-IC workflows and engaging with customers deploying next-generation packaging solutions.

You will collaborate with OSATs, foundries, and system companies to optimize design flows, deliver demos, and drive adoption of advanced packaging technologies. Remote or hybrid in the United States.

Qualifications

• Bachelor’s degree in Electrical or Electronics Engineering; Master’s preferred.
• 8+ years in semiconductor packaging, IC packaging, PCB, substrate or interposer design.
• Strong knowledge of advanced package design methodologies and 2.5D/3D-IC integration.
• Excellent customer-facing communication and presentation skills.
• Ability to work independently while collaborating with global teams.

Responsibilities

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with advanced package architecture, design implementation, and methodology development.
• Develop and demonstrate complete packaging workflows for Organic substrates, Silicon interposers, WLP, 2.5D/3D-IC integration, and chiplet-based architectures.
• Support customer evaluations, proof-of-concepts, benchmarks, and deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales to identify opportunities and provide pre-sales support.
• Work with R&D to communicate customer requirements and new technology needs.

Skills

Customer-facing communication

Presentation skills

Independent worker

Global collaboration

Technical leadership

Education

Bachelor’s degree in Electrical or Electronics Engineering

Master’s degree preferred

Tools

Cadence Integrity 3D-IC Platform

Cadence Sigrity

Clarity 3D Solver

Cadence Allegro X APD

Job description

Cadence Design Systems, Inc. is seeking a Principal Solutions Engineer for Advanced Packaging, 3D-IC, and SI/PI. The role focuses on leading applications engineering for Cadence 3D-IC workflows and engaging with customers deploying next-generation packaging solutions.

You will collaborate with OSATs, foundries, and system companies to optimize design flows, deliver demos, and drive adoption of advanced packaging technologies. Remote or hybrid in the United States.