Senior Silicon Failure Analysis Lead | Equity & Bonus

Google Inc.; San Diego (CA); Hybrid; USD 192,000 - 278,000; Full time

Job summary

Google is seeking a Silicon Failure Analysis Lead to drive end-to-end FA for SoCs integrated into mobile devices. You will partner with Design, Product, Test, Process Technology, Yield, Quality and Reliability teams to identify root causes and develop high-quality, cost-efficient ICs.

You will own FA activities across silicon to package, collaborating with cross-functional teams to reduce defects and improve reliability, while leveraging ATE/DFT diagnostics, curve tracing, and 3D analysis.

Qualifications

• Bachelor's degree in Electrical Engineering or a related field, or equivalent practical experience.
• 10 years of experience in SoC Failure Analysis.
• Experience operating FA equipment for Electrical Fault Isolation and using ATE with DFT data.

Responsibilities

• Drive yield, reliability, and RMA failure analysis through fault isolation and physical failure analysis.
• Lead systematic efforts to eliminate yield detractors and accelerate yield ramps while reducing DPPM and costs.
• Collaborate with external foundry partners and OSATs to align yield learning.
• Deliver insights to design and layout teams to support robust DFY practices and manufacturing ramps.
• Oversee operational readiness and safety compliance of regional FA laboratories.

Skills

Decision making

Stakeholder influence

Ambiguity handling

SoC failure analysis domain

Python/C/Java scripting

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Siemens Tessent tools (ATPG/MBIST/diagnosis)

Advantest 93k

Automated Test Equipment (ATE)

Job description

Google is seeking a Silicon Failure Analysis Lead to drive end-to-end FA for SoCs integrated into mobile devices. You will partner with Design, Product, Test, Process Technology, Yield, Quality and Reliability teams to identify root causes and develop high-quality, cost-efficient ICs.

You will own FA activities across silicon to package, collaborating with cross-functional teams to reduce defects and improve reliability, while leveraging ATE/DFT diagnostics, curve tracing, and 3D analysis.