Senior SI/PI Engineer - 3D/2.5D IC Interconnects

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Annual bonus

Equity grants

Comprehensive benefits

Job summary

Broadcom in San Jose, CA is seeking an experienced SI/PI engineer to drive interconnect technology for AI/ML, cloud and networking markets. You will work on parallel interfaces across 2.5D/3D integrations, sign-off, and automation, collaborating with R&D, IP teams, customers and manufacturing partners.

The role blends AE and RD duties, requiring DDR/LPDDR or HBM flow experience, TCL/Python scripting, and ability to manage multiple customers under tight timelines.

Qualifications

• Bachelor's degree with 12+ years or Master's with 10+ years in SI/PI or IC design.
• Experience with DDR/LPDDR and/or HBM SI/PI sign-off flow tools.
• Strong cross-functional collaboration across R&D, IP development, customers and manufacturing.

Responsibilities

• Mask based timing signoff using time domain simulations (SPICE) of parallel interfaces including 2.5D and 3D.
• Electromagnetic extraction and modeling of signal and power delivery channels (PCB, Package, Interposers).
• AC and transient analysis of Power Distribution Networks.
• IO channel analysis.
• Pre-layout modeling of transceivers as well as signal and PDN networks.
• Automate sign-off processes and work with EDA suppliers to improve tool accuracy and analysis flow.
• Generate analysis results, create presentations, sign-off reports, and support pre-sales activities to both customers and internal teams.

Skills

Independent

Self-starter

Multi-customer management

Sign-off workflow

TCL scripting

Python scripting

Cross-functional collaboration

Education

Bachelor's degree + 12+ years

Master's degree + 10+ years

Tools

Sign-off tool suite

Job description

Broadcom in San Jose, CA is seeking an experienced SI/PI engineer to drive interconnect technology for AI/ML, cloud and networking markets. You will work on parallel interfaces across 2.5D/3D integrations, sign-off, and automation, collaborating with R&D, IP teams, customers and manufacturing partners.

The role blends AE and RD duties, requiring DDR/LPDDR or HBM flow experience, TCL/Python scripting, and ability to manage multiple customers under tight timelines.