Senior Semiconductor Process Engineering Lead, FPA Production

Lockheed Martin

Goleta (CA)

On-site

USD 167,000 - 310,000

Full time

3 days ago

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Benefits offered by this job

Medical benefits

Flexible work arrangements

401(k) match

Paid time off

Job summary

Lockheed Martin in Goleta, CA is seeking a Semiconductor Process Engineering Manager to lead a high‑mix production team fabricating cutting‑edge infrared sensor arrays. You will optimize processes, lead equipment procurement, and drive yield and throughput while mentoring a skilled group.

Qualifications include a bachelor’s in engineering/physics, 8+ years in semiconductor packaging/FPA, and 5+ years of technical leadership. US citizenship and Secret clearance eligibility are required.

Qualifications

Bachelor's degree in Engineering, Physics, or related field.
Minimum of 8 years of experience in semiconductor packaging or FPA manufacturing in a clean room environment.
Minimum of 5 years of technical team leadership experience.

Responsibilities

Directing wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip‑chip bonding processes.
Developing and optimizing process flows, tooling, and equipment to maximize yield, efficiency, and throughput.
Collaborating with development and integration engineers to introduce new capabilities and lead capital procurement projects.
Analyzing test data, identifying trends, and implementing corrective actions for process control.
Creating and maintaining documentation, work instructions, and process control checklists.