Semiconductor Process Engineering Mgr - L5

Lockheed Martin; Goleta (CA); On-site; USD 167,000 - 310,000; Full time

Benefits offered by this job

Medical benefits

Flexible work arrangements

401(k) match

Paid time off

Job summary

Lockheed Martin in Goleta, CA is seeking a Semiconductor Process Engineering Manager to lead a high‑mix production team fabricating cutting‑edge infrared sensor arrays. You will optimize processes, lead equipment procurement, and drive yield and throughput while mentoring a skilled group.

Qualifications include a bachelor’s in engineering/physics, 8+ years in semiconductor packaging/FPA, and 5+ years of technical leadership. US citizenship and Secret clearance eligibility are required.

Qualifications

• Bachelor's degree in Engineering, Physics, or related field.
• Minimum of 8 years of experience in semiconductor packaging or FPA manufacturing in a clean room environment.
• Minimum of 5 years of technical team leadership experience.

Responsibilities

• Directing wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip‑chip bonding processes.
• Developing and optimizing process flows, tooling, and equipment to maximize yield, efficiency, and throughput.
• Collaborating with development and integration engineers to introduce new capabilities and lead capital procurement projects.
• Analyzing test data, identifying trends, and implementing corrective actions for process control.
• Creating and maintaining documentation, work instructions, and process control checklists.

Skills

Technical leadership

Process optimization

Data analysis

DOE/Statistics

MS Office

Communication skills

Cross-functional collaboration

Problem solving

Education

Bachelor's degree in Engineering/Physics

Advanced degree in Materials/Chemical/Mechanical/Physics

Tools

JMP

MATLAB

Excel

PowerPoint

Word

Job description

Standard Job Description

You will be the Semiconductor Process Engineering Mgr for the Advanced Focal Plane Array Production Team. Our team is responsible for supporting production operations, developing and optimizing semiconductor processes, managing equipment procurement, and driving yield and efficiency for Advanced Focal Plane arrays.

You will be the Semiconductor Process Engineering Mgr for the Advanced Focal Plane Array Production Team. Our team is responsible for supporting production operations, developing and optimizing semiconductor processes, managing equipment procurement, and driving yield and efficiency for Advanced Focal Plane arrays.

What You Will Be Doing

As the Semiconductor Process Engineering Mgr you will be responsible for leading a high‑mix production team that fabricates cutting‑edge infrared sensor arrays. Your responsibilities will include, but are not limited to:

• Directing wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip‑chip bonding processes.


• Developing and optimizing process flows, tooling, and equipment to maximize yield, efficiency, and throughput.


• Collaborating with development and integration engineers to introduce new capabilities and lead capital procurement projects.


• Analyzing test data, identifying trends, and implementing corrective actions for process control.


• Creating and maintaining documentation, work instructions, and process control checklists.

Why Join Us

The ideal candidate is a collaborative technical leader who thrives in a fast‑paced environment and is passionate about advancing FPA technology. This role offers the chance to shape critical manufacturing processes, mentor a skilled team, and make a tangible impact on next‑generation infrared sensors.

We are committed to supporting your work‑life balance and overall well‑being, offering flexible scheduling options. Learn more about Lockheed Martin’s comprehensive benefits package here

Further Information About This Opportunity

This position is located in Goleta, CA. Discover more about Lockheed Martin Missiles and Fire Control Santa Barbara Focal Plane here.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance.

Basic Qualifications

• Bachelors degree from and accredited college in Engineering, Physics, or related experience


• Minimum of 8 years of experience in semiconductor packaging or FPA manufacturing in a clean room environment with technical understanding of epoxy die attach/bonding, polishing, or Anti-Reflection Coating


• Minimum of 5 years of technical team leadership experience.


• Must be a US Citizen as this position is located in a facility that requires special access.

Desired Skills

• Advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering or Physics with more than 10 years of industry experience.


• Background in IR FPA packaging, specifically flip-chip hybridization techniques.


• Knowledge of semiconductor device physics, photodetectors, and FPAs.


• Proficiency in MS Office (Word, PowerPoint, Excel).


• Excellent engineering documentation skills and communication skills.


• Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.


• Experience leading multifunctional teams.


• Ability to multi-task, organize and prioritize assignments independently.


• Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).


• Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.


• Background in IR FPA packaging, specifically flip-chip hybridization techniques.


• Knowledge of semiconductor device physics, photodetectors, and FPAs.


• Proficiency in MS Office (Word, PowerPoint, Excel).


• Excellent engineering documentation skills and communication skills.


• Experience in developing skill sets of subordinates, situational leadership, and high emotional IQ.

Pay Information

Full-Time Salary Range: $166900.00 - $309900.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well‑being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered

Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.


• For (Washington state applicants only) Non‑represented full‑time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.