Detector Process Integration Engineer - Semiconductor

Lockheed Martin; Goleta (CA); On-site; USD 136,000 - 252,000; Full time

Job summary

Lockheed Martin in Goleta, California, seeks a Semiconductor Process Integration Engineer Stf to own requirements across key process modules and drive development of high-performance detector products.

The role includes leading cross-functional teams, improving process yield, and collaborating on advanced interconnects and packaging solutions. A strong background in semiconductor manufacturing and leadership is required.

Qualifications

• Bachelor's degree in engineering or materials science with 8+ years of industry experience.
• Experience running photolithography, etch, deposition, or hybridization processes/modules.
• Master's degree in the same fields with 5+ years of experience.
• Proficiency with MS Office (Word, PowerPoint, Excel).
• Strong engineering documentation skills.
• Ability to lead teams on projects from technician level to senior management.

Responsibilities

• Drive requirements and ownership across photolithography, etching, deposition, metrology, hybridization, advanced interconnects, and packaging processes.
• Develop and sustain compound detector products using data-driven analysis.
• Lead continuous-improvement initiatives to enhance process performance and yield.
• Collaborate with cross-functional teams to integrate advanced interconnects and packaging solutions.

Skills

Photolithography experience

Etching processes

Deposition processes

Hybridization processes

MS Office proficiency

Engineering documentation

Team leadership

Education

Bachelor's degree in engineering or materials science

Master's degree in engineering or materials science

Tools

Semiconductor equipment

DOE analysis familiarity

Job description

Lockheed Martin in Goleta, California, seeks a Semiconductor Process Integration Engineer Stf to own requirements across key process modules and drive development of high-performance detector products.

The role includes leading cross-functional teams, improving process yield, and collaborating on advanced interconnects and packaging solutions. A strong background in semiconductor manufacturing and leadership is required.