Semiconductor Packaging Engineer

SAAZ Micro Inc.; Camarillo (CA); On-site; USD 70,000 - 110,000; Full time

Job summary

SAAZ Micro Inc. in Camarillo, CA seeks a hands-on Mechanical Engineer to design, assemble and package infrared focal plane arrays for visible and infrared sensors.

You will work across mechanical and electrical subsystems, develop assembly processes and support testing. The role requires experience in lab or manufacturing environments with FPAs, familiarity with optoelectronic packaging, and proficiency in CAD tools such as AutoCAD or SolidWorks.

Qualifications

• Experience in a lab or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs.
• Experience with optoelectronic packaging technology and integration techniques.
• Ability to follow formal and informal assembly and integration processes.
• Proficiency with Microsoft Office tools (Word, Excel, and PowerPoint) and ability to create charts and communicate clearly.
• Experience with AutoCAD design, SolidWorks or other design software.

Responsibilities

• Integrate mechanical and electrical subsystems into a larger system.
• Develop assembly processes and yield improvement activities.
• Assemble FPAs into final device packaging including die attach, wire bonding, solder, inspect and test.
• Perform hands-on work on mechanical and electrical systems and components.
• Set up and operate test equipment to verify, evaluate, and troubleshoot systems and components.
• Read, understand and utilize engineering documentation including drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material.

Skills

Mechanical aptitude

Strong communication

Time management

Documentation

Problem solving

Tools

AutoCAD

SolidWorks

Excel

Job description

The successful applicant will be responsible for mechanical engineering, including mechanical design, assembly process development and implementation and packaging of infrared focal plane arrays, for visible and infrared sensors

Key Responsibilities:

• Work in mechanical and electrical subsystems and integrate them into a larger system
• Perform process related activities, such as process development and yield improvement activities.
• Assemble optoelectronic components of FPAs into final device packaging including die attach, wire bonding, solder, inspect and test
• Perform hands-on work on mechanical and electrical systems and components
• Use hand tools to perform integration and assembly tasks in a laboratory environment
• Set up and operate test equipment to verify, evaluate, and troubleshoot systems and components
• Perform electrical characterization of components and integrated assemblies
• Design fixturing, assembly aids, and support equipment
• Read, understand and utilize engineering documentation including: drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material
• Provide data analysis and status reporting to technical staff and leadership
• Support maintenance of lab instrumentation

Desired Qualifications:

• Experience in a laboratory or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs
• Experience with optoelectronic packaging technology and integration techniques
• Understanding and application of basic electrical and mechanical engineering concepts
• Ability to function safely in a laboratory environment performing assembly, integration, test, and troubleshooting tasks
• Ability to follow formal and informal assembly and integration processes
• Proficiency with Microsoft Office tools (Word, Excel, and PowerPoint) and ability to create charts and communicate clearly
• Experience with AutoCAD design, SolidWorks or other design software
• Possess problem solving skills, good mechanical aptitude, strong organizational skills, and the ability to work effectively with others and individually
• Understanding of mechanical and electrical assembly techniques
• Exceptional time management and organizational skills
• Strong oral and written communication skills with a strong attention to detail, and excellent documentation capability
• Candidate should be enthusiastic and highly self-motivated
• Ability to adapt to a flexible and changing schedule

Success Metrics:

• Mechanical designs released on time
• and without errors
• Fixture/tooling designs completed on schedule
• Assembly process development milestones completed
• Packaging process documentation completed
• Documentation quality
• Demonstrate good lab safety, cleanroom and ESD rule compliance