Senior Semi Assembly Lead - Night Shift (15% Diff)

Infineon Technologies; Morgan Hill (CA); On-site; USD 57,000 - 79,000; Full time

Job summary

Infineon Technologies is seeking a Sr Expert Operator Semi Assembly to join our Manufacturing and Operations team in Morgan Hill, CA. You will work in a high-tech cleanroom environment operating automated assembly equipment essential for silicon wafer processing and product assembly.

The role requires 3–5 years in semiconductor manufacturing or high-tech assembly, proficiency with wire bonders, die attach machines, MES software, and strong problem-solving abilities.

Qualifications

• 3–5 years of direct experience in a semiconductor manufacturing or high‑tech assembly environment.
• Knowledge of assembly machinery (wire bonders, die attach machines).
• Ability to guide, train, and mentor team members; proactive problem-solver.
• Strong debugging and troubleshooting using test equipment and schematics.
• Lean/Six Sigma awareness; attention to detail and visual inspection in cleanroom settings.

Responsibilities

• Operate and maintain automated assembly equipment, pick-and-place machines, or wafer processing tools.
• Perform micro-assembly, die bonding, wire bonding, and encapsulation tasks.
• Maintain production logs, test results, and reports; use MES or Excel for documentation.
• Read and interpret blueprints, schematics, and Work Instructions.
• Complete background and MRPT clearance as required.

Skills

Semiconductor manufacturing

High-tech assembly

Leadership

Troubleshooting

Lean Sigma

ESD control

Autonomy

Tools

Wire bonders

Die attach machines

MES software

Excel

Job description

Infineon Technologies is seeking a Sr Expert Operator Semi Assembly to join our Manufacturing and Operations team in Morgan Hill, CA. You will work in a high-tech cleanroom environment operating automated assembly equipment essential for silicon wafer processing and product assembly.

The role requires 3–5 years in semiconductor manufacturing or high-tech assembly, proficiency with wire bonders, die attach machines, MES software, and strong problem-solving abilities.