Senior RF Payload Engineer – Spacecraft Communications

Blue Origin; San Francisco (CA); On-site; USD 157,000 - 220,000; Full time

Job summary

Blue Origin in California seeks an Electrical Engineer IV to lead RF payload hardware efforts for the TeraWave network. You will bridge high-speed digital logic and phased array systems, guide architecture trade studies, and mentor junior engineers while coordinating with suppliers across programs.

You will design multi-layer, high-density interconnect PCBs, develop power systems, and drive lab bring-up and testing to ensure performance and reliability in space-grade environments.

Qualifications

• Bachelor's degree in Electrical Engineering or related technical field.
• 8+ years in complex hardware product development (telecom/aerospace).
• Experience with high-speed mixed-signal PCB layout tools (Altium/Cadence).
• Experience designing power delivery for high-power, dynamic systems.
• Experience using spectrum analyzers and VNA for hardware debug.

Responsibilities

• Lead architecture trade studies for RF payload hardware across subsystems.
• Mentor junior engineers and coordinate with suppliers and vendors.
• Direct bring-up, debugging, and lab testing of RF payload boards.
• Drive design decisions across programs and ensure regulatory compliance.
• Coordinate cross-program technical efforts and maintain high-quality documentation.

Skills

RF payload design

High-speed PCB design

EMI/EMC mitigation

Power electronics integration

Mentoring engineers

Cross-program coordination

Education

Bachelor's degree in Electrical Engineering

Master's degree (preferred)

Tools

Altium Designer

Cadence Allegro

Spectrum Analyzers

Vector Network Analyzers

Oscilloscopes

Job description

Blue Origin in California seeks an Electrical Engineer IV to lead RF payload hardware efforts for the TeraWave network. You will bridge high-speed digital logic and phased array systems, guide architecture trade studies, and mentor junior engineers while coordinating with suppliers across programs.

You will design multi-layer, high-density interconnect PCBs, develop power systems, and drive lab bring-up and testing to ensure performance and reliability in space-grade environments.