Senior RF Packaging Engineer - NPI & Prototyping

Guerrilla RF; Greensboro (NC); On-site; USD 120,000 - 165,000; Full time

Job summary

Guerrilla RF is seeking a Senior Packaging Engineer to bridge RFIC designers and OSAT partners, owning prototype builds and translating design intent into manufacturable packages. You will drive bonding diagrams, lead assembly reviews, and manage cross‑functional packaging programs for RF devices.

You will oversee qualification and transfer to production, ensure documentation accuracy, and work with advanced formats (QFN/DFN, flip-chip, WLCSP) to extend Guerrilla RF’s catalog while delivering

Qualifications

• BS in Electrical, Mechanical, Materials, or Manufacturing Engineering.
• 7+ years of semiconductor packaging or assembly experience.
• Experience with OSATs on new product builds and build package preparation.
• Hands-on knowledge of wire bond, die attach, molding, singulation, and tape-and-reel processes.
• Experience with lead frame packages (QFN/DFN) and at least one advanced format (flip-chip, WLCSP, laminate).
• Working knowledge of how packaging affects RF performance: parasitics, grounding, and thermal paths.
• Proficiency with bonding diagram and package drawing tools.
• Familiarity with JEDEC package and reliability standards.

Responsibilities

• Engage with RF IC designers to select package types meeting RF, thermal, and cost targets.
• Own bonding diagrams, package outline selection, and assembly drawings for prototypes.
• Advise designers on package parasitics and grounding effects.
• Translate packaging lessons into design rules and guidelines for the team.
• Serve as primary technical contact with OSAT partners for assemblies.
• Prepare and release complete build packages and ensure first-article quality.
• Lead technical calls to resolve assembly issues and drive yield improvement.
• Plan and track prototype builds across multiple package types and materials.
• Evaluate new package platforms and processes to extend the catalog.
• Drive 8D corrective actions with OSATs when defects occur.
• Support transition of validated prototypes to production-ready processes.

Skills

Wire bonding

Die attach

Molding

Singulation

Tape-and-reel

Lead frame packaging

RF performance considerations

OSAT coordination

JEDEC knowledge

Documentation & build records

Education

BS in Electrical, Mechanical, Materials, or Manufacturing Engineering

7+ years of semiconductor packaging or assembly experience

Tools

Bonding diagram software

Package drawing tools

Job description

Guerrilla RF is seeking a Senior Packaging Engineer to bridge RFIC designers and OSAT partners, owning prototype builds and translating design intent into manufacturable packages. You will drive bonding diagrams, lead assembly reviews, and manage cross‑functional packaging programs for RF devices.

You will oversee qualification and transfer to production, ensure documentation accuracy, and work with advanced formats (QFN/DFN, flip-chip, WLCSP) to extend Guerrilla RF’s catalog while delivering