RF & High‑Speed Package Design Engineer

NXP Semiconductors; Austin (TX); On-site; USD 110,000 - 150,000; Full time

Job summary

NXP Semiconductors N.V. is seeking a package design electrical engineer to deliver optimized packaging solutions for new products and technologies. You will run EM modeling tools and work with SoC/PCB teams to ensure electrical performance, manufacturability, and cost targets are met.

The role emphasizes experience in RF design, GHz modeling, and collaboration across engineering teams to advance package solutions across business lines.

Qualifications

• MSEE+ with experience in microelectronics packaging design and EM modeling or related field.
• Radio Frequency design experience and GHz modeling experience are preferred.
• Excellent communication and collaboration skills.

Responsibilities

• Provide optimized package design solutions for NPI and NTI.
• Define packages meeting electrical performance, manufacturability, and cost requirements.
• Run EM modeling tools to verify package performance and document results.
• Collaborate with SoC and PCB teams to optimize package performance.
• Provide electrical design rules to the Package Design Layout team and support layout optimization.

Job description

NXP Semiconductors N.V. is seeking a package design electrical engineer to deliver optimized packaging solutions for new products and technologies. You will run EM modeling tools and work with SoC/PCB teams to ensure electrical performance, manufacturability, and cost targets are met.

The role emphasizes experience in RF design, GHz modeling, and collaboration across engineering teams to advance package solutions across business lines.