Senior RF Hardware Engineer – CMOS/RFIC Innovation

QUALCOMM, Inc.; San Diego (CA); On-site; USD 146,000 - 218,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a senior member of the Si Process Packaging Solutions team to drive silicon process technology evaluation, development, and productization for Mixed-Signal/RF products with foundry partners.

You will evaluate bulk Si and RFSOI technologies, define device requirements, and run DOE, layout, and characterization to meet design needs, while interfacing with cross-functional teams and driving continuous improvements across RF circuits and device models.

Qualifications

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
• Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
• PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

Responsibilities

• Drive bulk Si and RFSOI technology evaluation, development and design enablement for RFFE designs, including RF switching and antenna circuits, receivers, transmitters.
• Work with Qualcomm design and product teams to define process and device requirements for continuous technology improvements.
• Define and execute test structures DOE, layout and characterization for process evaluation to meet design requirements.
• Design, simulate and test RF circuits to understand the process-design-layout interaction to guide process-design-layout optimization to achieve optimum performance.
• Interact with internal design teams, PDK teams, reliability, and product engineering to ensure technology support.
• Support Qualcomm design, layout, PTE and reliability teams to address their questions and resolve any device and design optimization issues.

Skills

ASIC design

Verification

Validation

Integration

RF knowledge

Communication skills

Education

Bachelor's degree in Science/Engineering

Master's degree in Science/Engineering

PhD in Science/Engineering

Tools

PDK basics (DRC/LVS/LPE)

BSIM/PSP-SOI models

Device test-structure development

Job description

Qualcomm Technologies, Inc. is seeking a senior member of the Si Process Packaging Solutions team to drive silicon process technology evaluation, development, and productization for Mixed-Signal/RF products with foundry partners.

You will evaluate bulk Si and RFSOI technologies, define device requirements, and run DOE, layout, and characterization to meet design needs, while interfacing with cross-functional teams and driving continuous improvements across RF circuits and device models.