Senior RF Packaging Design Leader for 6G Innovation

QUALCOMM, Inc.; San Diego (CA); On-site; USD 192,000 - 288,000; Full time

Benefits offered by this job

Bonus program

RSU grants

Benefits package

Job summary

Qualcomm Technologies, Inc. is seeking a senior leader to drive RF package design and electrical characterization for 6G-ready products. The role focuses on leading cross-functional teams across RF-IC, PCB, RF-EM, and Process Tech Development to advance packaging roadmaps and capabilities.

The candidate will manage, train, hire and mentor engineers across geographies, while guiding ...

Qualifications

• Master's degree in Science, Engineering, or related field

Responsibilities

• Work with Package designer & RF-IC block owners to discuss bump/ball assignments and trade-offs
• Establish methods to extract 3D parasitic models for RF packages
• Guide team to troubleshoot RF problems in testbenches
• Define RF simulation methodologies for various package types and IPs
• Collaborate with Advanced Technology team to develop robust RF packaging
• Update design and analysis flow and automate processes
• Create technical documentation and presentations
• Recruit and mentor engineers

Skills

RF packaging design

Electromagnetics

Transmission line theory

Crosstalk

Field solvers

Education

Bachelor's in Electrical/Mechanical/Chemical Eng

Master's in Electrical/Engineering

PhD in Engineering

Tools

ANSYS HFSS

Q3D

PSI

ADS

HSPICE

Cadence Allegro/APD/Sip

Mentor Xpedition

Job description

Qualcomm Technologies, Inc. is seeking a senior leader to drive RF package design and electrical characterization for 6G-ready products. The role focuses on leading cross-functional teams across RF-IC, PCB, RF-EM, and Process Tech Development to advance packaging roadmaps and capabilities.

The candidate will manage, train, hire and mentor engineers across geographies, while guiding ...