Senior Radar PCB Design Engineer

Echodyne Corp; Kirkland (WA); On-site; USD 125,000 - 187,000; Full time

Benefits offered by this job

RSU

Medical/dental/vision insurance

401(k) match

Paid company holidays

Flexible PTO

Life insurance

Disability insurance

Job summary

Echodyne is seeking a Senior PCB Design Engineer to own complex board designs for radar products and related hardware. You will collaborate with AMS, RF, Mechanical, and Manufacturing teams to translate requirements into high‑performance, manufacturable PCBAs.

The role emphasizes NPI, production release, and sustaining changes across the product lifecycle, with a focus on signal integrity, thermal management, and design for manufacturability.

Qualifications

• Bachelor's degree in Electronics or Electrical Engineering or related field.
• 10+ years of PCB design experience; export-controlled data eligibility (ITAR/EAR) may be required.
• Experience with RF/millimeter-wave/high-speed designs and CAD tools.

Responsibilities

• Plan and drive PCB designs from schematic review to production release.
• Translate schematics and requirements into multilayer PCBA for RF and mixed-signal applications.
• Apply SI/PI, EMI, thermal, and DFM/DFT best practices across designs.
• Collaborate with engineers and external vendors to optimize cost and manufacturability.
• Support NPI, revisions, and sustaining changes with cross-functional teams.

Skills

Altium Designer

RF PCB layout

High-speed digital

Schematic interpretation

Cross-functional collaboration

Signal integrity

DFM/DFT/DFM

Education

Bachelor's degree in Electronics or Electrical Engineering

10+ years PCB design experience

Tools

Arena PLM

Job description

Echodyne is seeking a Senior PCB Design Engineer to own complex board designs for radar products and related hardware. You will collaborate with AMS, RF, Mechanical, and Manufacturing teams to translate requirements into high‑performance, manufacturable PCBAs.

The role emphasizes NPI, production release, and sustaining changes across the product lifecycle, with a focus on signal integrity, thermal management, and design for manufacturability.