Senior/Principal RF Test Engineer, Texas Institute for Electronics

The University of Texas at Austin

Austin (TX)

On-site

USD 90,000 - 130,000

Full time

14 days+

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Job summary

The University of Texas at Austin is seeking a Senior/Principal RF Test Engineer for the Texas Institute for Electronics. This role involves developing RF test plans, executing measurements, and improving testing capabilities for advanced semiconductor technologies. The ideal candidate has an M.S. in Electrical Engineering and over 5 years of experience in RF testing. The position is on-site in Austin, Texas and offers collaboration in a cutting-edge research environment.

Qualifications

5+ years of hands-on experience in RF/microwave testing, characterization, or validation.
Deep working knowledge of S-parameter measurement techniques.
Ability to work cross-functionally with design and process teams.

Responsibilities

Develop and execute RF test plans for various bands.
Perform S-parameter characterization and noise figure measurements.
Author test reports and operating procedures.

Skills

RF/microwave testing

Python

VNA calibration

MATLAB

LabVIEW

Education

M.S. in Electrical Engineering

Tools

Vector Network Analyzers (VNAs)

Spectrum Analyzers

Signal Generators

Job description

Senior/Principal RF Test Engineer – Texas Institute for Electronics

Hiring Department: Operational Services and Strategies

Position Open To: All Applicants

Weekly Scheduled Hours: 40

FLSA Status: To Be Determined at Offer

Earliest Start Date: Ongoing

Position Duration: Expected to Continue

Location: Austin, TX

Eligibility: Must be eligible to work in the United States on a full‑time basis for any employer without sponsorship.

About TIE

Texas Institute for Electronics (TIE) is a transformative, well‑funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Mission: To advance the state of the art in 3D heterogeneous integration, chiplet‑based architectures, and multi‑component microsystems, catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high‑performance computing, and next‑generation healthcare devices.

Impact: Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, TIE is building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Technology: TIE’s 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency.

Purpose

The Senior/Principal RF Engineer will help ensure new technologies are evaluated and ready to move forward by providing reliable performance insights that support decision‑making, and strengthen the organization’s testing capabilities by improving processes, building effective tools, and creating clear guidance for internal teams and partners.

Senior RF Engineer Responsibilities

Develop and execute RF test plans for K‑band (18–27 GHz), Ka‑band (27–40 GHz), and W‑band (75–110 GHz) microsystems at wafer, die, module, and system levels.
Perform S‑parameter characterization, on‑wafer probing, noise figure measurements, and power sweeps using vector network analyzers, spectrum analyzers, and signal generators.
Design and implement automated test sequences using Python, MATLAB, or LabVIEW to drive measurement instruments and collect production‑grade data across process corners and temperature.
Develop de‑embedding methodologies and calibration strategies for high‑frequency measurements, including TRL, LRRM, and multi‑line calibrations for on‑wafer and package‑level probing.
Correlate measured RF results against EM simulation models (HFSS, ADS, AWR, CST) to validate design intent and feed deviations back to the design and packaging teams.
Characterize passive and active RF components—including transmission lines, filters, LNAs, PAs, and T/R modules—within 3.0D heterogeneously integrated assemblies.
Support test infrastructure buildout, including fixture design, probe card specification, and lab setup for TIE’s RF characterization capabilities.
Author test reports, standard operating procedures, and design‑for‑test guidelines to support ecosystem partners and internal engineering teams.

Principal RF Engineer Responsibilities

Define and own the RF test strategy for TIE’s 3.0D heterogeneously integrated microsystems across K‑band (18–27 GHz), Ka‑band (27–40 GHz), and W‑band (75–110 GHz), spanning wafer, die, module, and system levels.
Architect end‑to‑end test flows—from design‑for‑testability requirements through production screening—ensuring robust, repeatable, and scalable characterization of RF, mixed‑signal, and antenna‑in‑package subsystems.
Lead development of advanced de‑embedding, calibration, and measurement methodologies for novel 3DHI interconnect structures, including hybrid bonding interfaces, glass/Si interposers, and redistribution layers.
Drive test‑to‑model correlation across EM simulation (HFSS, ADS, AWR, CST) and measured data, establishing feedback loops with design, process, and packaging teams to accelerate yield learning and performance optimization.
Specify, procure, and commission RF test infrastructure—including probe stations, VNA configurations, automated handlers, and environmental chambers—for TIE’s characterization lab buildout.
Establish and mentor the RF test engineering team, setting technical standards, review processes, and best practices for measurement automation, data management, and statistical analysis.
Engage with foundry, EDA, metrology, and defense‑program partners to define and validate test enablement requirements for next‑generation RF packaging technologies.
Author test strategies, reliability qualification plans, reference test procedures, and design‑for‑test guidelines that become part of TIE’s Assembly Design Kit deliverables.

Senior RF Engineer Qualifications

M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
5+ years of hands‑on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K‑band frequencies and above.
Deep working knowledge of S‑parameter measurement, VNA calibration techniques, de‑embedding, and on‑wafer probing methodologies.
Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.
Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test‑to‑model correlation.
Understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.
Ability to work cross‑functionally with design, packaging, EDA, and process teams in a fast‑paced R&D environment.
Location: Austin, Texas.

Principal RF Engineer Qualifications

M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.
10+ years of progressively responsible experience in RF/microwave test engineering, characterization, or validation—including at least 3 years in a technical leadership or principal role.
Expert‑level knowledge of S‑parameter characterization, advanced VNA calibration (TRL, LRRM, multi‑line), de‑embedding, and on‑wafer probing techniques at millimeter‑wave frequencies.
Proven ability to architect automated RF test frameworks for R&D characterization and production screening using Python, MATLAB, LabVIEW, or equivalent.
Deep understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, loss, and thermal interactions across interposers, RDLs, and 3D stacked assemblies.
Strong proficiency with RF simulation tools (Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio) for rigorous test‑to‑model correlation and root‑cause analysis.
Track record of building or scaling RF test organizations, including lab infrastructure planning, team development, and process definition.
Ability to influence cross‑functional roadmaps and partner with design, packaging, EDA, and program management teams in a defense‑adjacent R&D setting.
Location: Austin, Texas.

Preferred Qualifications

Senior RF Engineer:

Ph.D. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
Experience testing Antenna‑in‑Package (AiP), RFIC/SiP, or 3D‑stacked RF front‑end modules for communications or sensing applications.
Hands‑on experience with wafer‑level probing at cryogenic temperatures or under thermal‑vacuum conditions for high‑frequency systems.
Familiarity with 3DHI design flows and the associated test challenges across heterogeneous die‑to‑die and die‑to‑interposer interfaces.
Knowledge of GaAs, GaN, SiGe, or CMOS RF processes and their impact on test strategy and fixture design.
Experience developing automated test frameworks for production screening or reliability qualification of RF components.
Strong technical writing and presentation skills for defense‑sector reporting and industry collaboration.

Principal RF Engineer:

Ph.D. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.
Experience defining RF test strategies for Antenna‑in‑Package (AiP), RFIC/SiP, or 3D‑stacked RF front‑end modules in volume or pre‑production environments.
Hands‑on experience with cryogenic testing, thermal‑vacuum characterization, or reliability stress testing of high‑frequency systems.
Familiarity with 3DHI design and assembly flows and the unique test challenges of heterogeneous die‑to‑die and die‑to‑interposer interfaces.
Knowledge of GaAs, GaN, SiGe, and CMOS RF processes and their implications for test planning, fixture design, and yield analysis.
Publication or patent record in millimeter‑wave measurement techniques, calibration methods, RF packaging test, or antenna characterization.
Experience contributing to design kit or PDK test enablement deliverables.
Strong technical writing and presentation skills for defense‑sector reporting and industry collaboration.

Salary Range

TIE pays industry‑competitive salaries.

Working Conditions

May work around standard office conditions.
Repetitive use of a keyboard at a workstation.
Use of manual dexterity (e.g., using a mouse).

Work Shift

Monday‑Friday: 8 am – 5 pm.

Required Materials

Resume/CV.
Three work references with contact information; at least one reference should be from a supervisor.

Equal Opportunity Employer

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

Pay Transparency

The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor’s legal duty to furnish information.

Employment Eligibility Verification

If hired, you will be required to complete the federal Employment Eligibility Verification I‑9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

E-Verify

The University of Texas at Austin uses E-Verify to check the work authorization of all new hires effective May 2015. The university’s company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following: