Senior/Principal RF Test Engineer, Texas Institute for Electronics

University of Texas; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Dynamic work environment

Opportunity for significant impact

Job summary

The University of Texas in Austin seeks a Lead RF Test Engineer, responsible for defining RF test strategies for integrated microsystems and leading the RF test engineering team. Ideal candidates will possess a Ph.D. in Electrical Engineering or related disciplines, with over 10 years of experience in RF/microwave testing, and a strong command of measurement methodologies and automation tools. You'll collaborate across functions to drive innovation in RF packaging technologies, making significant contributions to both research and production environments.

Qualifications

• Expert-level knowledge of S-parameter characterization.
• 10+ years of progressively responsible experience in RF test engineering.
• Strong technical writing and presentation skills.

Responsibilities

• Define and own RF test strategies for integrated microsystems.
• Architect end-to-end test flows for testing processes.
• Lead development of advanced calibration and measurement methodologies.

Skills

RF/microwave testing

S-parameter measurement

Python

MATLAB

LabVIEW

Electromagnetic effects understanding

Education

Ph.D. in Electrical Engineering

M.S. in Electrical Engineering

Tools

VNAs

spectrum analyzers

signal generators

power meters

Keysight ADS

CST Studio

Job description

* Define and own the RF test strategy for TIE’s 3.0D heterogeneously integrated microsystems across K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz), spanning wafer, die, module, and system levels.* Architect end-to-end test flows—from design-for-testability requirements through production screening—ensuring robust, repeatable, and scalable characterization of RF, mixed-signal, and antenna-in-package subsystems.* Lead development of advanced de-embedding, calibration, and measurement methodologies for novel 3DHI interconnect structures, including hybrid bonding interfaces, glass/Si interposers, and redistribution layers.* Drive test-to-model correlation across EM simulation (HFSS, ADS, AWR, CST) and measured data, establishing feedback loops with design, process, and packaging teams to accelerate yield learning and performance optimization.* Specify, procure, and commission RF test infrastructure—including probe stations, VNA configurations, automated handlers, and environmental chambers—for TIE’s characterization lab buildout.* Establish and mentor the RF test engineering team, setting technical standards, review processes, and best practices for measurement automation, data management, and statistical analysis.* Engage with foundry, EDA, metrology, and defense-program partners to define and validate test enablement requirements for next-generation RF packaging technologies.* Author test strategies, reliability qualification plans, reference test procedures, and design-for-test guidelines that become part of TIE’s Assembly Design Kit (ADK) deliverables.* M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.* 5+ years of hands-on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K-band frequencies and above.* Deep working knowledge of S-parameter measurement, VNA calibration techniques, de-embedding, and on-wafer probing methodologies.* Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.* Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test-to-model correlation.* Understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.* Ability to work cross-functionally with design, packaging, EDA, and process teams in a fast-paced R&D environment.* Location: Austin, Texas* M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.* 10+ years of progressively responsible experience in RF/microwave test engineering, characterization, or validation—including at least 3 years in a technical leadership or principal role.* Expert-level knowledge of S-parameter characterization, advanced VNA calibration (TRL, LRRM, multi-line), de-embedding, and on-wafer probing techniques at millimeter-wave frequencies.* Proven ability to architect automated RF test frameworks for R&D characterization and production screening using Python, MATLAB, LabVIEW, or equivalent.* Deep understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, loss, and thermal interactions across interposers, RDLs, and 3D stacked assemblies.* Strong proficiency with RF simulation tools (Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio) for rigorous test-to-model correlation and root-cause analysis.* Track record of building or scaling RF test organizations, including lab infrastructure planning, team development, and process definition.* Ability to influence cross-functional roadmaps and partner with design, packaging, EDA, and program management teams in a defense-adjacent R&D setting.* Location. Austin, Texas* Ph.D. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.* Experience testing Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules for communications or sensing applications.* Hands-on experience with wafer-level probing at cryogenic temperatures or under thermal-vacuum conditions for high-frequency systems.* Familiarity with 3DHI design flows and the associated test challenges across heterogeneous die-to-die and die-to-interposer interfaces.* Knowledge of GaAs, GaN, SiGe, or CMOS RF processes and their impact on test strategy and fixture design.* Experience developing automated test frameworks for production screening or reliability qualification of RF components.* Strong technical writing and presentation skills for defense-sector reporting and industry collaboration.* Ph.D in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.* Experience defining RF test strategies for Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules in volume or pre-production environments.* Hands-on experience with cryogenic testing, thermal-vacuum characterization, or reliability stress testing of high-frequency systems.* Familiarity with 3DHI design and assembly flows and the unique test challenges of heterogeneous die-to-die and die-to-interposer interfaces.* Knowledge of GaAs, GaN, SiGe, and CMOS RF processes and their implications for test planning, fixture design, and yield analysis.* Publication or patent record in millimeter-wave measurement techniques, calibration methods, RF packaging test, or antenna characterization.* Experience contributing to design kit or PDK test enablement deliverables.* Strong technical writing and presentation skills for defense-sector reporting and industry collaboration.**Start Here, Change the World**At The University of Texas at Austin, tradition meets innovation in the heart of a city that frequents lists of the best places to live and work. Named by Forbes as one of America's Best Large Employers for the sixth year in a row in 2025, UT offers both a dynamic work environment and a gateway to vibrant local culture. Whether you're at the forefront of the student experience, conducting world-changing research or supporting the engine that drives Texas’ flagship university, working at UT means making a lasting impact on our city, our state and our world.Our more than 20,000 faculty and staff empower 55,000+ students to challenge ideas, pursue passions and shape their futures. Joining UT, you’ll become part of a community dedicated to making a meaningful impact on campus and throughout the world.Please see our .**Comments and Inquiries:**Email comments to [e-mail]. For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: . For more job information, call the Human Resource Service Center at [phone], or toll-free at [phone].