Principal Packaging Engineer — Power & High-Density

NXP Semiconductors NV; Chandler (AZ); On-site; USD 130,000 - 190,000; Full time

Job summary

NXP Semiconductors NV in Chandler, AZ is seeking a Senior Semiconductor Packaging Engineer to lead package development for new products and technologies across business lines. You will define architectures, materials, structures, and assembly processes to meet reliability, performance, manufacturability, and cost targets.

You will drive cross-functional programs with Marketing, Design, Product Engineering, and external partners, monitor advances in PLP and power packaging, and support NPI/NTI

Qualifications

• Bachelor's degree or higher in a related engineering field.
• 10+ years of experience in semiconductor packaging development and related fields.
• Knowledge of IC package families (QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages).
• Experience leading cross-functional technical projects across multiple teams.
• Ability to communicate technical tradeoffs, risks, recommendations clearly to technical and management audiences.
• Fluent English communication (written and verbal).
• Deep expertise in advanced packaging areas such as fan-out, panel-level packaging, 2.5D/3D integration, chiplets, silicon interposers, high-density substrates or high power packaging.

Responsibilities

• Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost.
• Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, OSATs, material suppliers, and external technology partners.
• Monitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging; define and drive associated technology roadmaps.
• Ensure package deliverables are met for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support.
• May involve international travel to NXP assembly sites, OSATs, suppliers, and technology partners.

Skills

Packaging engineering

Cross-functional leadership

Fluent English

Communicate tradeoffs

Project management

Education

B.S. or higher in Mechanical Eng./Materials Science/Chemical Eng./Electrical Eng.

Job description

NXP Semiconductors NV in Chandler, AZ is seeking a Senior Semiconductor Packaging Engineer to lead package development for new products and technologies across business lines. You will define architectures, materials, structures, and assembly processes to meet reliability, performance, manufacturability, and cost targets.

You will drive cross-functional programs with Marketing, Design, Product Engineering, and external partners, monitor advances in PLP and power packaging, and support NPI/NTI