Head of Next-Gen Power Silicon & Packaging Innovation

NXP Semiconductors NV

Virginia

On-site

USD 200,000 - 320,000

Full time

2 days ago

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Job summary

NXP Semiconductors NV seeks a Director of Advanced Power Silicon & Packaging Technology to shape the strategy and execution for next-generation power delivery across silicon, packaging, and system integration. You will partner with design, packaging, manufacturing, and product teams to push power efficiency, density, and reliability in AI, data center, and HPC platforms.

The role emphasizes leadership, IP creation, and collaborations with foundries, OSATs, EDA vendors, and research

Qualifications

BS in Electrical Engineering, Physics, Materials Science, or related discipline.
MS or PhD preferred.

Responsibilities

Define and execute the long-term roadmap for advanced power silicon technologies, packaging, and chip-package-system co-design.
Lead cross-functional teams across silicon design, packaging, architecture, manufacturing, and product organizations.
Drive adoption of GaN, SiC, and advanced CMOS/BCD power processes to improve efficiency and density.
Establish packaging roadmaps for 2.5D/3D, chiplet architectures, fan-out, and embedded power delivery.
Lead PI, SI, thermal performance, reliability, and PDN optimization; manage IP portfolios and external partnerships.
Mentor senior technical leaders and build organizational capability; drive patent generation and industry collaboration.