Senior Post-Fab Module Engineer - Trench MOSFET Expert

ON Semiconductor; Hopewell Junction (NY); On-site; USD 120,000 - 180,000; Full time

Job summary

ON Semiconductor seeks a Senior Module Engineer to lead the 300mm Post Fab team in East Fishkill, NY. You will drive trench MOSFET technology development, improve device performance, and ramp volume manufacturing while overseeing wafer thinning and ultra-thin wafer handling.

As a senior leader, you will manage stress and thermal effects on thinned wafers and guide the team toward ambitious reliability and yield targets in a fast-paced environment.

Qualifications

• Experience in advanced wafer thinning and handling of ultra-thin wafers.
• Knowledge of backside metallization processes.
• Ability to analyze and mitigate stress and thermal effects on thinned wafers.
• Proven leadership and track record of guiding technical teams.

Responsibilities

• Lead a senior module engineering team within the Post Fab group.
• Develop and ramp trench MOSFET technology for new products.
• Improve device performance and drive manufacturing throughput.
• Collaborate with cross-functional teams to meet quality and schedule goals.

Skills

Wafer thinning

Ultra-thin wafer handling

Backside metallization

Stress analysis

Thermal effects management

Team leadership

Job description

ON Semiconductor seeks a Senior Module Engineer to lead the 300mm Post Fab team in East Fishkill, NY. You will drive trench MOSFET technology development, improve device performance, and ramp volume manufacturing while overseeing wafer thinning and ultra-thin wafer handling.

As a senior leader, you will manage stress and thermal effects on thinned wafers and guide the team toward ambitious reliability and yield targets in a fast-paced environment.