Physical Design Engineer

Broadcom Inc.; San Jose (CA); Hybrid; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical insurance

Dental & Vision

401(k) with company match

ESPP

EAP

Holidays

Sick leave

Vacation

Job summary

Broadcom Inc. in San Jose, CA, seeks a design engineer with physical layout skills to advance next‑generation ASIC products, focusing on parallel interfaces and 2.5D/3D interconnects.

You will work across R&D, IP development, customers, and manufacturing partners on new interconnect technologies. The role blends layout, electrical analysis, and automation, with opportunities to shape technology roadmaps and deliver high‑impact silicon solutions.

Qualifications

• Bachelor's degree in Electrical Engineering or Computer Science with 12+ years of related work experience or a Master’s degree with 10+ years of related work experience.
• Experience across IC, Package and PCB layout databases and tools.
• Strong scripting in TCL and Python to automate routine tasks.

Responsibilities

• Design implementation and physical layout of power grids, 2.5D and 3D die-die interconnects.
• Perform DRC, LVS, and electrical checks.
• Automate common processes and design steps.
• Develop high-speed signal interconnects with SI/PI engineers.
• Conduct electrical analysis and optimize ubump and RDL patterns.
• Evaluate and develop new 2.5D/3D interconnect technologies and roadmaps.

Skills

Independent, self-starter

Multitask across organization

Guidance with incomplete information

IC/Package/PCB layout databases

Education

Bachelor's degree in Electrical Engineering or Computer Science

Master's degree in Electrical Engineering or Computer Science

12+ years related work experience

Tools

TCL scripting

Python scripting

IC/PCB/Package layout tools

Job description

Job Description

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects. We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners. This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities

• Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.
• DRC, LVS, and electrical checking.
• Ability to automate common processes and design steps.
• Development of high-speed signal interconnects working alongside SI and PI engineers.
• Electrical analysis and optimization of ubump and RDL patterns.
• Evaluation and development of new 2.5D and 3D interconnect technologies.
• Technology and testchip roadmapping with a focus on advanced packaging.

Skills and Experience

• Independent, self-starter who can work across a worldwide organization and customer base.
• Ability to manage multiple concurrent customers under short timelines.
• Comfort with providing guidance and direction with incomplete information.
• Experience with various IC, Package and PCB layout databases and tools.
• Strong TCL, Python scripting experience to automate routine tasks.
• Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

• Medical
• dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave
• vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.

We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status or medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.