Senior Photonics Mechanical Lead – RF & Optics Packaging

MACOM; Hamilton Township (NJ); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Health, dental, vision insurance

Employer-sponsored 401(k) plan

Paid time off

Professional development opportunities

RSU and cash bonus eligibility

Job summary

MACOM is seeking a Senior Photonics Mechanical Engineer to provide technical leadership for opto-mechanical package and enclosure solutions from concept to production. You will coordinate with RF/photonics design teams, QA, and suppliers to ensure cost-effective, manufacturable packaging and robust build processes.

The role requires 10+ years in mechanical design with electronics assemblies, experience in FEA/CFD, and ability to drive multiple projects under tight deadlines.

Qualifications

• MS or BS in Mechanical Engineering or similar studies.
• Minimum of 10 years of experience in relevant design engineering with process development and design emphasis on electronic assemblies.
• Must be able to obtain a security clearance and USITAR compliance.

Responsibilities

• Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development.
• Collaborate with internal teams to establish packaging technologies and assembly processes focusing on cost, manufacturability, yield, and quality.
• Plan and establish engineering build requirements for new product introductions.
• Lead design reviews to ensure compliance with DFM guidelines.
• Develop tooling for high volume, high mix processes.
• Establish application notes for new products.

Skills

RF packaging

Photonics packaging

Mechanical design

Finite element analysis

CFD

Thermal analysis

Quality & reliability

Cross-functional collaboration

AutoCAD/SolidWorks

MS Office

Education

MS/BS in Mechanical Engineering

Tools

AutoCAD

SolidWorks

Job description

MACOM is seeking a Senior Photonics Mechanical Engineer to provide technical leadership for opto-mechanical package and enclosure solutions from concept to production. You will coordinate with RF/photonics design teams, QA, and suppliers to ensure cost-effective, manufacturable packaging and robust build processes.

The role requires 10+ years in mechanical design with electronics assemblies, experience in FEA/CFD, and ability to drive multiple projects under tight deadlines.