Senior Photonics Packaging Engineer

MACOM; Hamilton (NJ); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Health, dental, and vision insurance

401(k) plan

Paid time off

Professional development opportunities

RSU awards and bonuses

Job summary

MACOM in the United States seeks a Senior Photonics Mechanical Engineer to provide technical leadership for new product introductions from concept to production release, delivering opto-mechanical packages and enclosures on schedule.

You will partner with RF/photonics design, QA, reliability, supply chain and external vendors to optimize packaging technologies, lead multiple development projects, and solve thermal and mechanical challenges with FEA/CFD tools.

Qualifications

• MS or BS in Mechanical Engineering.
• Minimum of 10 years of experience in design engineering with process development and electronics assemblies.
• U.S. persons and ability to obtain security clearance per ITAR.

Responsibilities

• Lead mechanical design and packaging for RF and photonics modules.
• Collaborate with internal teams and external suppliers on packaging technologies and assembly processes.
• Plan and establish Build Requirements for new product introductions.
• Develop tooling for high-volume, high-mix manufacturing.
• Perform design reviews and ensure DFM compliance.

Skills

RF & photonics packaging

Leadership

FEA / CFD analysis

Communication skills

Six Sigma

MS Office

Education

MS in Mechanical Engineering

BS in Mechanical Engineering

Tools

AutoCAD

SolidWorks

FEA software

CFD software

Job description

MACOM in the United States seeks a Senior Photonics Mechanical Engineer to provide technical leadership for new product introductions from concept to production release, delivering opto-mechanical packages and enclosures on schedule.

You will partner with RF/photonics design, QA, reliability, supply chain and external vendors to optimize packaging technologies, lead multiple development projects, and solve thermal and mechanical challenges with FEA/CFD tools.