Optomechanical Engineer

QUANTUM COMPUTING, INC.

Bedford (MA)

On-site

USD 70,000 - 100,000

Full time

14 days+

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Job summary

QUANTUM COMPUTING, INC. is looking for an Optomechanical Engineer in Bedford, MA. This position entails designing and developing precision opto-mechanical assemblies for Aerospace & Defense applications. Candidates should have 2–8 years of experience in opto-mechanical engineering, strong proficiency in SolidWorks, and the ability to work independently. The role offers the chance to lead essential projects from concept through to manufacturing. Ideal for motivated self-starters looking to apply their skills in a dynamic environment.

Qualifications

  • 2–8 years of experience in opto-mechanical engineering or similar.
  • Solid fundamentals of mechanical design and materials selection.
  • Demonstrated experience in product design and development.
  • Working experience packaging EO/OE modules.

Responsibilities

  • Lead packaging design at the component level for EO/OE devices.
  • Define system-level opto-mechanical architecture.
  • Conceptualize and design mechanical assemblies.
  • Own CAD in SolidWorks; manage design documentation.
  • Support qualification programs per military standards.
  • Present technical work clearly to team members and customers.

Skills

Opto-mechanical engineering
SolidWorks proficiency
Problem-solving
Data-driven mindset
Strong communication skills

Education

B.S. or M.S. in Mechanical Engineering or equivalent

Tools

SolidWorks
Zemax OpticStudio
ANSYS Fluent
COMSOL

Job description

JOB TITLE : Optomechanical Engineer

DIVISION: Photonics

LOCATION: Bedford, MA

REPORTS TO: Engineering Manager

Scope of the Job:

QCi is seeking an Optomechanical Engineer — at a level commensurate with experience — to design and develop precision opto-mechanical assemblies and photonic module packages for Aerospace & Defense and advanced photonics applications. This individual will work across system-level architecture and component-level packaging, owning projects from concept through prototype, qualification, and manufacturing transfer. The ideal candidate is a motivated self-starter and problem solver with a data-driven mindset who operates effectively with minimal supervision.

Duties / Responsibilities:

  • Lead packaging design at the component level for EO/OE devices including DFB lasers, optical receivers, fiber-optic components, and photonic integrated circuits (PICs) — from die attach and fiber pigtailing through hermetic sealing.
  • Define system-level opto-mechanical architecture: translate optical and electrical requirements into integrated mechanical layouts, identify packaging constraints, and establish interface specifications across subsystems.
  • Conceptualize, design, and prototype mechanical assemblies spanning free-space optical benches, fiber-optic subassemblies, and multi-element module housings.
  • Own all mechanical CAD in SolidWorks: parts, assemblies, drawings, and configurations; enforce GD&T to ASME Y14.5; manage revision-controlled design documentation and vendor DFM/DFA coordination.
  • Generate and review mechanical and optical drawings; perform tolerance stack-up analysis to ensure dimensional compliance over full environmental range.
  • Design jigs, fixtures, and assembly tooling to support fiber pigtailing, lens alignment, die attach, and wire/ribbon bonding operations.
  • Support qualification programs per MIL-STD-810, MIL-STD-883, or Telcordia GR-468; define test plans, analyze data, and author qualification reports.
  • Present technical work clearly to team members and customers; produce engineering reports, SOPs, and design review packages within an ISO 9001 / AS9100 QMS.

Required Skills & Experience:

  • B.S. or M.S. in Mechanical Engineering, Optical Engineering, Applied Physics, or equivalent discipline.
  • 2–8 years of experience in opto-mechanical engineering, photonic module packaging, or precision optical instrument design; level and compensation commensurate with experience.
  • Solid fundamentals of mechanical design: materials selection (metals, ceramics, optical glasses) and manufacturing processes.
  • Demonstrated experience in product design and development — from concept through qualified, manufacturable hardware.
  • Working experience packaging EO/OE modules: DFB lasers, optical receivers, fiber-optic assemblies, and PICs.
  • Expert proficiency in SolidWorks (parts, assemblies, drawings, GD&T, configurations) — this is the primary design tool for this role.
  • Motivated self-starter and problem solver with a data-driven mindset; drives tasks to closure independently.
  • Strong written and verbal communication skills; experienced presenting technical work to internal teams and external customers.
  • Must be a United States Citizen or Legal Permanent Resident (ITAR requirement).

Additional Preferred Skills:

  • Familiarity with Zemax OpticStudio for basic ray tracing and optical tolerance analysis.
  • Experience with finite element flow simulation tools (e.g., ANSYS Fluent, COMSOL, or SolidWorks Flow Simulation) for aerodynamic analysis and thermal-fluid performance characterization.
  • Experience with hermetic packaging: Kovar housings, glass-to-metal seals, TEC integration, and optical adhesives.
  • Knowledge of qualification standards: MIL-STD-810, MIL-STD-883, Telcordia GR-468, or ECSS.
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