Senior PCB & Silicon Packaging Architect

Arm Limited; Chandler (AZ); Hybrid; USD 250,000 - 338,000; Full time

Benefits offered by this job

Hybrid working

Accommodations during recruitment

Job summary

Arm Limited is seeking an Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work with SoC teams to define requirements and craft platform architectures for optimal PCB and packaging integration.

The role focuses on translating technology needs into practical hardware platforms, driving routing strategies, and collaborating with packaging teams across geographies to balance performance, manufacturability, and

Qualifications

• SoC architectures and high-performance embedded compute.
• High-speed IO standards such as PCIe Gen5/6/7 for embedded systems.
• Embedded board design with FPGAs and PMICs.
• IC packaging technologies and their impact on PCB design for SoCs.
• Collaboration with chip packaging teams to optimize pin-outs.
• Escape routing analysis for high-density SoCs.
• Signal and Power Integrity analysis for boards and packaging.
• PCB fabrication processes, stackups, and vias.
• Define PCB layout guidelines and constraints.
• Support early silicon and board architecture decisions.

Responsibilities

• Collaborate with global engineering groups to specify and develop PCB and silicon package integration.
• Drive PCB development alongside the chip packaging team; optimize routing and layer trade-offs.
• Translate technology requirements into platform architectures; provide timescale estimates.
• Communicate technical concepts clearly to architecture and technology leads.
• Evaluate design trade-offs to deliver cost-effective, reliable solutions.

Skills

SoC architectures

PCIe Gen5/6/7

LPDDR5/6

FPGA & PMICs

PCB packaging integration

Pin-out optimization

Signal Integrity

Power Integrity

PCB fabrication & stackups

Cadence OrCAD/Allegro

Tools

Cadence OrCAD/Allegro

Job description

Arm Limited is seeking an Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work with SoC teams to define requirements and craft platform architectures for optimal PCB and packaging integration.

The role focuses on translating technology needs into practical hardware platforms, driving routing strategies, and collaborating with packaging teams across geographies to balance performance, manufacturability, and