Senior PCB & Silicon Package Architect

Arm; Chandler (AZ); On-site; USD 250,000 - 338,000; Full time

Job summary

Arm is seeking an Electronics Engineer specializing in PCB Silicon packaging co-design and system-level hardware architecture. You will work with SoC teams, architects and platform leads to define requirements and features, optimize routing, and ensure reliable, cost-effective integration across silicon and PCB packaging ecosystems.

Responsibilities include collaborating with global engineering groups, translating requirements into platform architectures, and providing time-bound estimates to

Qualifications

• Deep background in SoC architectures and platforms with high-performance embedded compute
• Experience with PCIe Gen5/6/7, LPDDR5/6, CSI/DSI
• Proficiency in embedded system board design with complex LSIs like FPGAs
• Familiarity with IC packaging technologies and PCB design impact
• Experience collaborating with chip packaging teams to influence pin-outs
• Expertise in signal/Power Integrity analyses for boards and packages
• Knowledge of PCB fabrication processes, stackup and substrate materials
• Ability to evaluate package pinouts against PCB routability and cost

Responsibilities

• Collaborate with engineering groups across geographies to define solutions for PCB and silicon package integration
• Drive PCB development alongside chip packaging teams, including breakout, routing strategies and layer optimization
• Translate technology requirements into platform architectures and communicate clearly to stakeholders
• Provide timescale estimates and justification into the program team

Skills

SoC architectures

PCB design

High-speed IO

Signal integrity

Power management

Embedded systems

FPGA

Tools

Cadence OrCAD

Cadence Allegro

Job description

Arm is seeking an Electronics Engineer specializing in PCB Silicon packaging co-design and system-level hardware architecture. You will work with SoC teams, architects and platform leads to define requirements and features, optimize routing, and ensure reliable, cost-effective integration across silicon and PCB packaging ecosystems.

Responsibilities include collaborating with global engineering groups, translating requirements into platform architectures, and providing time-bound estimates to